Electronic Assembly Process Reliability (16 results)

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Taschenbuch. Condition: Neu. Power Electronic Packaging | Design, Assembly Process, Reliability and Modeling | Yong Liu | Taschenbuch | xviii | Englisch | 2014 | Humana | EAN 9781489987976 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.…

Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also:Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrationsPresents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designsPower Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices.…

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Paperback. Condition: Brand New. 612 pages. 9.25x6.10x1.38 inches. In Stock.

Hardcover. Condition: Brand New. 591 pages. 9.50x6.50x1.50 inches. In Stock.

paperback. Condition: New. Paperback Pages Number: 310 Language: Chinese. The process reliability of electronic products. there is the whole process of service products in factory production and market. Modern electronic Mechanical Engineering Series 12 Five-Year national key publishing planning boutique project: modern electronics assembly process reliability of engaging in electronic assembly technology and equipment and other technology to study the entire 50 years. deep in the electronic manufacturing process relia.…

paperback. Condition: New. Paperback. Pub Date: 2015-09-01 Pages: 376 Language: Chinese Publisher: Electronic Industry Press book introduces the environmental protection. standards. materials. technology. quality and reliability of the technology green electronics assembly process involved. which including process reliability based on test analysis. technology selection and application of materials and components. nearly 40 typical cases of failure and fault 18 types of studies. process control technology and other def.…

paperback. Condition: New. Paperback. Pub Date: 2022-07-01 Pages: 420 Language: Chinese Publisher: Electronics Industry Press . standards. materials. quality and reliability technology. including the basis of reliability of electronic assembly process. environmental protection technology in the implementation process of electronic assembly process. test and analysis technology. selection and application technology of materials and components. more than 20 typical Failure and breakdown case studies. process defect contr.…