Embedded Software Third International (9 results)
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 76.10
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book constitutes the refereed proceedings of the Third International Conference on Embedded Software, EMSOFT 2003, held in Philadelphia, PA, USA in October 2003.The 20 revised full papers presented together with three invited papers were carefully reviewed and selected from 60 submissions. All current topics in embedded software are addressed: formal methods and model-based development, middleware and fault tolerance, modelling and analysis, programming languages and compilers, real-time scheduling, resource-aware systems, and systems on a chip.…
Embedded Software and Systems : Third International Conference, ICESS 2007, Daegu, Korea, May 14-16, 2007, Proceedings
Lee, Yann-Hang (EDT); Kim, Heung-nam (EDT); Kim, Sung Won (EDT); Park, Yongwan (EDT); Yang, Laurence Tianruo (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 132.35
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Softcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller5-star sellerCondition: New
US$ 132.00
US$ 3.00 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Embedded Software and Systems : Third International Conference, ICESS 2007, Daegu, Korea, May 14-16, 2007, Proceedings
Lee, Yann-Hang (EDT); Kim, Heung-nam (EDT); Kim, Sung Won (EDT); Park, Yongwan (EDT); Yang, Laurence Tianruo (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 142.15
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Embedded Software and Systems : Third International Conference, ICESS 2007, Daegu, Korea, May 14-16, 2007, Proceedings
Lee, Yann-Hang (EDT); Kim, Heung-nam (EDT); Kim, Sung Won (EDT); Park, Yongwan (EDT); Yang, Laurence Tianruo (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 137.91
US$ 19.96 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 146.24
US$ 19.88 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In English.
Embedded Software and Systems : Third International Conference, ICESS 2007, Daegu, Korea, May 14-16, 2007, Proceedings
Lee, Yann-Hang (EDT); Kim, Heung-nam (EDT); Kim, Sung Won (EDT); Park, Yongwan (EDT); Yang, Laurence Tianruo (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 147.91
US$ 19.96 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 143.09
US$ 48.79 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book constitutes the refereed proceedings of the Third International Conference on Embedded Software and Systems, ICESS 2007, held in Daegu, Korea, May 2007. The 75 revised full papers cover embedded architecture, embedded hardware, embedded software, HW-SW co-design and SoC, multimedia and HCI, pervasive/ubiquitous computing and sensor network, power-aware computing, real-time systems, security and dependability, and wireless communication. …
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 186.13
US$ 19.96 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Paperback. Condition: Brand New. 1st edition. 829 pages. 9.00x6.00x1.25 inches. In Stock.
