Seller: Zoom Books Company, Lynden, WA, U.S.A.
Condition: good. Book is in good condition and may include underlining highlighting and minimal wear. The book can also include "From the library of" labels. May not contain miscellaneous items toys, dvds, etc. . We offer 100% money back guarantee and 24 7 customer service.
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Seller: Books From California, Simi Valley, CA, U.S.A.
hardcover. Condition: Very Good.
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Seller: Textbooks_Source, Columbia, MO, U.S.A.
paperback. Condition: Good. 2nd Edition. Ships in a BOX from Central Missouri! May not include working access code. Will not include dust jacket. Has used sticker(s) and some writing or highlighting. UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
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US$ 47.91
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Add to basketPaperback. Condition: Very Good. The book has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.
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Seller: Majestic Books, Hounslow, United Kingdom
US$ 47.04
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Published by Morgan Kaufmann, 2017
Language: English
Seller: Antiquariat Bookfarm, Löbnitz, Germany
US$ 34.88
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Add to basketKindle Ausgabe. 1. 294 Seiten Ehem. Bibliotheksexemplar mit üblichen Merkmalen wie Signatur und Stempel. Moderate Lager- und Gebrauchsspuren. Text bis auf selten mögliche Anstreichungen sauber. Insgesamt guter Zustand. Sprache: englisch. Ex library book with stamps and signature. Slight signs of use. good condition. Language: english. Sprache: Englisch Gewicht in Gramm: 550.
Published by T&F India, 2022
Language: English
Seller: Books in my Basket, New Delhi, India
US$ 58.75
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Add to basketHardcover. Condition: New. ISBN:9781032501529,Territorial restriction maybe printed on the book. This is an Int'l edition, ISBN and cover may differ from US edition, Contents same as US edition.
Seller: Revaluation Books, Exeter, United Kingdom
US$ 84.80
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Add to basketPaperback. Condition: Brand New. 297 pages. 9.00x7.25x0.75 inches. In Stock.
Condition: New. pp. 234.
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Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: New.
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Published by Mechanical Industry Press, 2024
ISBN 10: 7111755804 ISBN 13: 9787111755807
Language: English
Seller: liu xing, Nanjing, JS, China
US$ 159.33
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Add to basketpaperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2024-06 Pages: 268 Publisher: China Machine Press The book Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology was written by Dr. Beth Keser. former president of the International Microelectronics Assembly and Packaging Society (IMAPS). and translated by the 43rd Institute of China Electronics Technology Group Corporation. Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology explains various fan-out and e.
Published by Chapman and Hall/CRC, 2025
ISBN 10: 103283191X ISBN 13: 9781032831916
Language: English
Seller: Ria Christie Collections, Uxbridge, United Kingdom
US$ 256.84
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Published by IGI Global 2015-01-30, 2015
ISBN 10: 1466661941 ISBN 13: 9781466661943
Language: English
Seller: Chiron Media, Wallingford, United Kingdom
US$ 483.48
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Add to basketHardcover. Condition: New.
ISBN 10: 1032501529 ISBN 13: 9781032501529
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New.
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Published by Mechanical Industry Press, 2000
ISBN 10: 711128822X ISBN 13: 9787111288220
Language: Chinese
Seller: liu xing, Nanjing, JS, China
US$ 96.58
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Add to basketpaperback. Condition: New. Paperback. Pub Date: June 2010 Pages: 332 Language: Chinese in Publisher: Machinery Industry Press. high-performance embedded computing. explained from the performance. power. and energy consumption of embedded systems with the traditional general-purpose computer system design difference. High-performance embedded computing Chapter 1 Background information Chapter 2 describes the use of embedded systems processor. Chapter 3. Chapter 4 of the research program. to discuss the multi-processor s.
Published by Machinery Industry Press, 2015
ISBN 10: 7111499301 ISBN 13: 9787111499305
Language: Chinese
Seller: liu xing, Nanjing, JS, China
US$ 107.42
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Add to basketpaperback. Condition: New. Language:Chinese.High Performance Embedded Computing (English 2nd edition).
Published by Machinery Industry Press, 2016
ISBN 10: 7111540514 ISBN 13: 9787111540519
Language: Chinese
Seller: liu xing, Nanjing, JS, China
US$ 116.58
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Add to basketpaperback. Condition: New. Language:Chinese.Pub. Date:2016-06-01 Pages:329 Publisher: Paperback Machinery Industry Press. this book describes the design method of modern embedded computing system from the aspects of performance. power and energy consumption and cost. The first chapter is an overview of embedded computing. the second chapter describes a variety of processors. the third chapter describes the programming. the fourth chapter discusses the process. the operating system. the fifth chapter describes the multi.
ISBN 10: 7111204166 ISBN 13: 9787111204169
Seller: liu xing, Nanjing, JS, China
US$ 90.31
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Add to basketpaperback. Condition: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2006-12-01 Language: Chinese Publisher: Machinery Industry Press Information Title: High Performance Embedded Computing (English ) Price: 65.00 yuan Author : Wolfe Publishing : Mechanical Industry Publishing Date : 2006-12-01 ISBN: 9787111204169 words: Page: Revision: Binding: Folio: product ID: 10621738 Editor no Summary h2 book is one of the classic original library . using a unique method to quantify discussed modern embedded computing systems design . the book based o.Four Satisfaction guaranteed,or money back.
ISBN 10: 8793609620 ISBN 13: 9788793609624
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New.
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