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Integration Noc Based Soc Architectures (23 results)
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Condition: New. pp. 290.
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US$ 84.18
Convert currencyUS$ 8.79 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: New. pp. 290 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
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US$ 93.10
Convert currencyUS$ 11.76 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketCondition: New. pp. 290.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems Series)
Seller: Pistil Books Online, IOBA, Seattle, WA, U.S.A.
Association Member: IOBA
Seller rating 5 out of 5 stars
Hard Cover. Condition: Fine. No Jacket. A clean, unmarked book with a tight binding. 278 pages.
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US$ 126.78
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Add to basketCondition: New.
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US$ 139.00
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Add to basketBrand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address.
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hardcover. Condition: As New. Ships Out Tomorrow!
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3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 150.46
Convert currencyUS$ 16.20 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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US$ 178.51
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Add to basketCondition: New.
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3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 186.83
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Add to basketCondition: New. In.
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3D Integration for NoC-based SoC Architectures
Published by Springer US, Springer New York, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Language: English
US$ 146.69
Convert currencyUS$ 73.50 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
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US$ 99.08
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Add to basketCondition: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher.
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US$ 213.12
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Add to basketPaperback. Condition: Like New. Like New. book.
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US$ 202.76
Convert currencyUS$ 74.41 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketBuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
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US$ 253.51
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Add to basketHardcover. Condition: Like New. Like New. book.
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3D Integration for NoC-based SoC Architectures
Published by Springer New York Dez 2012, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
US$ 143.22
Convert currencyUS$ 27.17 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketTaschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 288 pp. Englisch.
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US$ 119.92
Convert currencyUS$ 57.88 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-.
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3D Integration for NoC-based SoC Architectures
Published by Springer-Verlag New York Inc., 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
US$ 176.52
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Add to basketPaperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 439.
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3D Integration for NoC-based SoC Architectures
Published by Springer US, Springer New York Dez 2012, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
US$ 143.22
Convert currencyUS$ 70.89 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketTaschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 288 pp. Englisch.
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3D Integration for Noc-Based Soc Architectures
Published by SPRINGER NATURE Dez 2010, 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
US$ 195.30
Convert currencyUS$ 27.17 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketBuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 278 pp. Englisch.
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US$ 167.04
Convert currencyUS$ 57.88 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketGebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-.
