Interconnects Vlsi Design (36 results)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condition: As New. Unread book in perfect condition.
Language: English
Published by Kluwer Academic Publishers, Netherlands, 2000
- Hardcover
- First Edition
Seller: PsychoBabel & Skoob Books, Didcot, United KingdomPsychoBabel & Skoob Books
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US$ 65.43
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Hardcover. Condition: Very Good. No Dust Jacket. First Edition. Hard cover with printed boards, no jacket; Cover shows hardly noticable storage wear. Previous owner's name on FEP. Contents are otherwise clean, bright and tight. J. Used.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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PF. Condition: New.
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Carbon Nanotube Based VLSI Interconnects: Analysis and Design
Kaushik, Brajesh Kumar (Author)/ Majumder, Manoj Kumar (Author)
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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US$ 87.70
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Paperback. Condition: Brand New. 2015 edition. 100 pages. 9.00x6.25x0.50 inches. In Stock.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illu…strates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. Carbon Nanotube Based VLSI Interconnects | Analysis and Design | Brajesh Kumar Kaushik (u. a.) | Taschenbuch | SpringerBriefs in Applied Sciences and Technology | xi | Englisch | 2014 | Springer | EAN 9788132220466 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 He…idelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
- Hardcover
Seller: Buchpark, Trebbin, GermanyBuchpark
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Condition: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustad…t (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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US$ 191.91
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Condition: New. In.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 191.88
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- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condition: New.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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US$ 206.60
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titis…ee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book 'Signal Propagation on Interconnects', Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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US$ 236.17
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Condition: New. pp. 248.
- Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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US$ 239.91
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Condition: New. Presents a selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI). This book addresses the need of developers and researchers in the field of VLSI chip and package design. The papers in it cover a wide area of research directions. Editor(s…): Grabinski, Hartmut. Num Pages: 236 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 244 x 170 x 15. Weight in Grams: 526. . 2000. Hardback. . . . .
More images- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. Interconnects in VLSI Design | Hartmut Grabinski | Taschenbuch | vii | Englisch | 2012 | Humana | EAN 9781461369547 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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US$ 281.93
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Condition: New. Presents a selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI). This book addresses the need of developers and researchers in the field of VLSI chip and package design. The papers in it cover a wide area of research directions. Editor(s…): Grabinski, Hartmut. Num Pages: 236 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 244 x 170 x 15. Weight in Grams: 526. . 2000. Hardback. . . . . Books ship from the US and Ireland.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 310.45
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Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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US$ 299.33
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Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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US$ 299.33
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 330.47
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Condition: As New. Unread book in perfect condition.
Published by Springer 978-81-322-2046-6, New Denhi, 2046
- Softcover
Seller: Burton Lysecki Books, ABAC/ILAB, Winnipeg, MB, CanadaBurton Lysecki Books, ABAC/ILAB
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US$ 63.00
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[978-81-322-2046-6] 2015. (Trade paperback) Fine. 86pp. Illustrations, tables, formulas, references. Publisher series: Springer Briefs in Applied Sciences and Technology. (Science, Engineering, Science).
- Softcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
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US$ 151.03
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Condition: new. Questo è un articolo print on demand.
- Hardcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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US$ 191.96
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and… in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book 'Signal Propagation on Interconnects', Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects. 248 pp. Englisch.
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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US$ 191.96
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 19…98, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book 'Signal Propagation on Interconnects', Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects. 248 pp. Englisch.
- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
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US$ 162.86
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany…, May 13-15, 1998, and in Titisee-Neusta.
- Hardcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
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US$ 162.86
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Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side…), Germany, May 13-15, 1998, and in Titisee-Neusta.
