Lead Free Soldering Process Development (22 results)
Language: English
Published by John Wiley and Sons, 2020
- Hardcover
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Language: English
Published by Wiley, 2020
- Hardcover
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Language: English
Published by Wiley, 2020
- Hardcover
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Language: English
Published by Wiley, 2020
- Hardcover
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Language: English
Published by Wiley, 2020
- Hardcover
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Language: English
Published by Wiley, 2020
- Hardcover
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Language: English
Published by John Wiley & Sons Inc, New York, 2020
- Hardcover
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Hardcover. Condition: new. Hardcover. Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this re…ference will help practitioners address issues in research, development and production. Among other topics, the book addresses: Developments in process engineering (SMT, Wave, Rework, Paste Technology) Low temperature, high temperature and high reliability alloys Intermetallic compounds PCB surface finishes and laminates Underfills, encapsulants and conformal coatings Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the books explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Lead-free Soldering Process Development and Reliability (Quality and Reliability Engineering Series)
Language: English
Published by Wiley, 2020
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Lead-free Soldering Process Development and Reliability (Quality and Reliability Engineering Series)
Language: English
Published by Wiley, 2020
- Hardcover
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Language: English
Published by Wiley, 2020
- Hardcover
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Condition: As New. Unread book in perfect condition.
Language: English
Published by John Wiley and Sons Ltd, 2020
- Hardcover
Seller: THE SAINT BOOKSTORE, Southport, United KingdomTHE SAINT BOOKSTORE
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Hardback. Condition: New. New copy - Usually dispatched within 4 working days.
Lead-free Soldering Process Development and Reliability (Quality and Reliability Engineering Series)
Language: English
Published by Wiley, 2020
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Lead-free Soldering Process Development and Reliability (Quality and Reliability Engineering Series)
Language: English
Published by Wiley, 2020
- Hardcover
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Language: English
Published by John Wiley & Sons Inc, 2020
- Hardcover
- First Edition
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Condition: New. 2020. 1st Edition. Hardcover. . . . . .
Lead-free Soldering Process Development and Reliability (Quality and Reliability Engineering Series)
Language: English
Published by Wiley, 2020
- Hardcover
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Language: English
Published by John Wiley & Sons Inc, 2020
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 481 pages. 9.25x6.25x1.00 inches. In Stock.
Language: English
Published by John Wiley & Sons, 2020
- Hardcover
Seller: moluna, Greven, Germanymoluna
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Condition: New. JASBIR BATH, is the owner of Bath Consultancy LLC which provides consulting and training services in the electronics manufacturing industry. He was the Corporate Lead Engineer with Solectron Corporation/ Flex for ten years with a role involving tin-lead and.
Language: English
Published by John Wiley & Sons Inc, 2020
- Hardcover
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Condition: New. 2020. 1st Edition. Hardcover. . . . . . Books ship from the US and Ireland.
Language: English
Published by John Wiley & Sons Inc, 2020
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 481 pages. 9.25x6.25x1.00 inches. In Stock.
Language: English
Published by John Wiley & Sons Inc, New York, 2020
- Hardcover
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Hardcover. Condition: new. Hardcover. Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this re…ference will help practitioners address issues in research, development and production. Among other topics, the book addresses: Developments in process engineering (SMT, Wave, Rework, Paste Technology) Low temperature, high temperature and high reliability alloys Intermetallic compounds PCB surface finishes and laminates Underfills, encapsulants and conformal coatings Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the books explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Language: English
Published by Wiley Jul 2020, 2020
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. Neuware - Covering the major topics in lead-free solderingLead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference… will help practitioners address issues in research, development and production.Among other topics, the book addresses:\* Developments in process engineering (SMT, Wave, Rework, Paste Technology)\* Low temperature, high temperature and high reliability alloys\* Intermetallic compounds\* PCB surface finishes and laminates\* Underfills, encapsulants and conformal coatings\* Reliability assessmentsIn a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book's explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers.Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Language: English
Published by John Wiley & Sons Inc, New York, 2020
- Hardcover
- Print on Demand
Seller: CitiRetail, Stevenage, United KingdomCitiRetail
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Hardcover. Condition: new. Hardcover. Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this re…ference will help practitioners address issues in research, development and production. Among other topics, the book addresses: Developments in process engineering (SMT, Wave, Rework, Paste Technology) Low temperature, high temperature and high reliability alloys Intermetallic compounds PCB surface finishes and laminates Underfills, encapsulants and conformal coatings Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the books explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
