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Published by Ps Pub Co, London, 2023
Seller: PS PUBLISHIING, London, United Kingdom
Book
Softcover. Condition: New. Dust Jacket Condition: no dj. First. Understanding materials used in advanced packaging and microelectromechanical systems (MEMS).
Published by Ps Pub Co, London, 2023
Seller: PS PUBLISHIING, London, United Kingdom
Book
Softcover. Condition: New. Dust Jacket Condition: no dj. First. A deep dive into the complex process of sustainable packaging design, showcasing advanced techniques for material selection and recycling.
Published by Berlin : Springer,, 2009
ISBN 10: 0387782184ISBN 13: 9780387782188
Seller: Versandantiquariat buch-im-speicher, Berlin, Germany
Association Member: GIAQ
Book
Condition: Gut. 719 S. : Mit Abb., graph. Darst.; Sehr sauber und ohne Lesespuren / Very good condition, maybe unread book. Sprache: Englisch Gewicht in Gramm: 1193 24 cm, roter Org.-Pappb. / red hardcover.
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Published by New York, Institute of Electrical and Electronics Engineers, 1997
Seller: Antiquariat Bookfarm, Löbnitz, Germany
Book
183 S. ehem. Bibliotheksexemplar mit Kleberesten auf Einband und Stempel innen, guter Zustand. Sprache: Englisch Gewicht in Gramm: 550.
Published by CRC Press, 2023
ISBN 10: 0367556006ISBN 13: 9780367556006
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: New.
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Published by Springer Nature Singapore, 2018
ISBN 10: 9811319081ISBN 13: 9789811319082
Seller: Buchpark, Trebbin, Germany
Book
Condition: Wie neu. Zustand: Wie neu | Seiten: 316 | Sprache: Englisch.
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Published by Syrawood Publishing House, 2023
ISBN 10: 1647403707ISBN 13: 9781647403706
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Book
Condition: New. Brand New Original US Edition.We Ship to PO BOX Address also. EXPEDITED shipping option also available for faster delivery.This item may ship from the US or other locations in India depending on your location and availability.
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Published by CRC Press, 2020
ISBN 10: 0367335387ISBN 13: 9780367335380
Seller: Basi6 International, Irving, TX, U.S.A.
Book
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Published by World Scientific Publishing Company, 2018
ISBN 10: 9813237600ISBN 13: 9789813237605
Seller: Lucky's Textbooks, Dallas, TX, U.S.A.
Book
Condition: New.
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Published by Springer, 2018
ISBN 10: 3319832093ISBN 13: 9783319832098
Seller: booksXpress, Bayonne, NJ, U.S.A.
Book
Soft Cover. Condition: new.
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Published by Taylor & Francis, 2021
Seller: Books in my Basket, New Delhi, India
Book
Hardcover. Condition: New. ISBN:9780367335380.
Published by National Defence Industry Press, 2016
ISBN 10: 7118100617ISBN 13: 9787118100617
Seller: liu xing, Nanjing JiangSu, JS, China
Book
paperback. Condition: New. Language:Chinese.Advanced materials for thermal management of electronic packaging.
Published by Lala Maurizio, 2018
ISBN 10: 012812640XISBN 13: 9780128126400
Seller: Brook Bookstore On Demand, Napoli, NA, Italy
Book Print on Demand
Condition: new. Questo è un articolo print on demand.
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Published by Springer, 2013
ISBN 10: 1461427924ISBN 13: 9781461427926
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Book Print on Demand
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
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Published by Springer, 2016
ISBN 10: 3319450972ISBN 13: 9783319450971
Seller: Books Puddle, New York, NY, U.S.A.
Book
Condition: New.
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Published by Springer Singapore, 2015
ISBN 10: 9811000700ISBN 13: 9789811000706
Seller: moluna, Greven, Germany
Book Print on Demand
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Includes over 130 peer-reviewed papers from professional researchers Covers a wide range of topics including, but not limited to, image science, materials science and digital media Presents the latest scientific achievements and current t.
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Published by Springer Singapore, 2019
ISBN 10: 9811090785ISBN 13: 9789811090783
Seller: moluna, Greven, Germany
Book Print on Demand
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Includes over 130 peer-reviewed papers from professional researchers Covers a wide range of topics including, but not limited to, image science, materials science and digital media Presents the latest scientific achievements and current t.
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Published by Springer, 2011
ISBN 10: 1441977589ISBN 13: 9781441977588
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: Fine. Book is in Used-LikeNew condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear.
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Published by ???????, 2020
ISBN 10: 712233497XISBN 13: 9787122334978
Seller: liu xing, Nanjing JiangSu, JS, China
Book
Hardcover. Condition: New. HardCover. Pub Date: 2020-04-01 Pages: 355 Language: English Publisher: Chemical Industry Press Freeform optics is a new LED lighting optics technology. its advantage lies in the high degree of design freedom and accurate light energy distribution Control can provide an effective optical design method to achieve high-quality LED lighting.?This book systematically introduces a series of free-form optical algorithms and design methods for LED packaging and applications. including various circul.
Published by Chemical Industry Press, 2021
ISBN 10: 7122394484ISBN 13: 9787122394484
Seller: liu xing, Nanjing JiangSu, JS, China
Book
Hardcover. Condition: New. HardCover.Pub Date:2021-12-01 Pages:247 Language:English Publisher:Chemical Industry PressThe main advantages of solid-state lighting are energy saving. environmental friendliness and long life. and LED (Light Emitting Diode) packaging is the main guarantee for obtaining these advantages technology. This book not only covers the basic principles of lighting. colorimetry. photometry. light-emitting diodes. but also provides a comprehensive introduction to LED wafer and chip manufacturing. LED .
Published by Chemical Industry Press, 2021
ISBN 10: 7122394840ISBN 13: 9787122394842
Seller: liu xing, Nanjing JiangSu, JS, China
Book
Hardcover. Condition: New. HardCover.Pub Date:2021-12-01 Pages:273 Language:English Publisher:Chemical Industry Press 3D RF integration application is an important application development direction of through silicon via (TSV) 3D integration technology. With the rise of 5G and millimeter-wave applications. thin-film bulk acoustic resonator (FBAR) devices based on high-resistance silicon TSV wafer-level packaging. and radio frequency microelectromechanical system (RF MEMS) switching devices have gradually achieved comme.
Published by Trans Tech Pubn, 2008
ISBN 10: 0878493832ISBN 13: 9780878493838
Seller: dsmbooks, Liverpool, United Kingdom
Book
Paperback. Condition: Like New. Like New. book.
Published by Chemical Industry Press, 2021
ISBN 10: 7122392279ISBN 13: 9787122392275
Seller: liu xing, Nanjing JiangSu, JS, China
Book
Hardcover. Condition: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protection) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .