Microelectronic Packaging Technology Materials (5 results)
- Hardcover
Seller: HPB-Diamond, Dallas, TX, U.S.A.HPB-Diamond
Contact seller5-star sellerCondition: Used - Very good
US$ 42.74
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hardcover. Condition: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority.
- Hardcover
Seller: liu xing, Nanjing, JS, Chinaliu xing
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US$ 498.50
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Hardcover. Condition: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protect…ion) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .
- Hardcover
Seller: liu xing, Nanjing, JS, Chinaliu xing
Contact seller5-star sellerCondition: New
US$ 498.50
US$ 18.00 shippingShips from China to U.S.A.Quantity: 3 available
Hardcover. Condition: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protect…ion) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .
- Softcover
Seller: liu xing, Nanjing, JS, Chinaliu xing
Contact seller5-star sellerCondition: New
US$ 52.58
US$ 18.00 shippingShips from China to U.S.A.Quantity: 1 available
paperback. Condition: New. Paperback. Pub Date: 2011 08 Pages: 137 Language: Chinese Publisher: Higher Education Press Vocational electronics manufacturing class professional planning materials: microelectronic packaging technology entire body of knowledge in microelectronic packaging technology is divided into two parts. Chapte…r 12. The first part of the process. and the second part is a typical package. Include the introduction. wafer dicing. die attach. chip interconnect. molding. other process. dual in-line package.
- Softcover
Seller: liu xing, Nanjing, JS, Chinaliu xing
Contact seller5-star sellerCondition: New
US$ 73.50
US$ 18.00 shippingShips from China to U.S.A.Quantity: 3 available
paperback. Condition: New. Language:Chinese.Microelectronic packaging technology higher education second five planning materials and electronic materials and application technology planning materials series.
