Microstructure Properties High Performance Copper by Wang Chang (1 results)

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  • Language: Chinese

    Published by Tsinghua University Press, 2015

    7302423369 / 9787302423362

    • Softcover

    Seller: liu xing, Nanjing, JS, Chinaliu xing

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    Condition: New

    US$ 69.08

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    Quantity: 5 available

    paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2015-12-01 Publisher: Tsinghua University Press book selected industrialized micron SiC powder materials. chemical copper plating process for preparing a Cu-coated SiCp composite powders. and composite powders and composition morphology was analyzed. In the composite powder as raw material. the use of vacuum sintering and non-vacuum sintering two processes to prepare SiCp volume fraction of 30%. 40% and 50% of SiCpCu composites and microstructure and Comp.…