Published by National Bureau of Standards for the Bureau of Aeronautics, Dept of the Navy, 1955
Seller: Sheapast Art and Books, Sherman Oaks, CA, U.S.A.
First Edition
No Binding. Condition: Very Good. 1st Edition. Modular Design of Electronics and Mechanized Production of Electronics (formerly PROJECT TINKERTOY). A program carried out by the National Bureau of Standards for the Bureau of Aeronautics, Dept of the Navy. This project is an Industrial Preparedness Measure.It's completion is marked by the establishment of a feasible system for fabricating military electronic equipment. 4 Vols in 1 binder. v. 1, Summary of modular design of electronics and mechanized production of electronics [with list of references]; by Robert L. Henry and Herbert H. Rosen. [1954.] v. 2, Techniques for converting from conventional design of electronics to modular design of electronics; Lucien P. Tuckerman, William W. Murphy, jr. and Herbert H. Rosen. [1954.] v. 3, Hand fabrication technique and photographic processing for modular design of electronics [with list of references]; by Harold S. Horiuchi and Russell Burroughs. [1954.] v. 4, Mechanized production of electronics [articles]. [1954.] Modular units, machine made and automatically assembled, may revolutionize electronics. "Project Tinkertoy" - the revolutionary modular design and mechanized production of electronic parts - may well comprise the building blocks of the electronic world of the future. Developed by the National Bureau of Standards, Washington, D. C., this new approach to electronic fabrication involves the "modular design concept" of mounting adhesive carbon resistors, printed circuits, and other miniaturized components on standard, uniform steatite (ceramic) wafers. The wafers are then stacked together, like building blocks, to form a "module." This module will perform all the functions of one or more electronic stages. It is a standardized, interchangeable subassembly with all the requirements of an electronic circuit, plus the factors of ruggedness, reliability, and compactness. Individual modules may be combined to form major electronic subassemblies.