Particulate Filled Polymer Composites (4 results)

Condition: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In poor condition, suitable as a reading copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,800grams, ISBN:9780582087828.…

Taschenbuch. Condition: Neu. Polymer Composites for Microelectronic Applications | Micro-sized Particulate Filled Polymer Composites | Alok Agrawal (u. a.) | Taschenbuch | 212 S. | Englisch | 2016 | LAP LAMBERT Academic Publishing | EAN 9783659833366 | Verantwortliche Person für die EU: BoD - Books on Demand, In de Tarpen 42, 22848 Norderstedt, info[at]bod[dot]de | Anbieter: preigu.…

Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The objective of the book is to report on the possibility of using ceramic fillers in polymers to make composites suitable for microelectronic applications. The first part of the book is on the development of theoretical heat conduction models for estimation of effective thermal conductivity of such polymer composites with single/hybrid fillers. The second part has provided the description of the materials used, routes adopted to fabricate the various composites and the details of the experiments. The last part has emphasized on the physical, mechanical, thermal and dielectric characteristics of all the epoxy and polypropylene based composites filled with single filler i.e. micro-sized AlN/Al2O3. A comparative evaluation of the effects of premixing of solid glass microspheres with AlN/Al2O3 is also presented. The polymer composites developed with enhanced thermal conductivity, improved glass transition temperature, reduced thermal expansion coefficient and modified dielectric constant are expected to have adequate potential for a wide variety of applications particularly in microelectronic industries like electronic packaging, encapsulations, printed circuit board substrates etc.…