Process Device Modeling (27 results)

Condition: Good. 273 pp., hardcover, ex library, else text and binding clean and tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.

Hardcover. Condition: Bon. Ancien livre de bibliothèque. Légères traces d'usure sur la couverture. Edition 1986. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Good. Former library book. Slight signs of wear on the cover. Edition 1986. Ammareal gives back up to 15% of this item's net price to charity organizations.

Hardcover. Condition: Fine. Volume 1 in the "Advances in CAD or VLSI" series.

Condition: New.

Condition: New. In.

Condition: New. pp. 880.

Paperback. Condition: Brand New. 880 pages. 9.25x6.18x1.73 inches. In Stock.

Taschenbuch. Condition: Neu. Process and Device Modeling for Integrated Circuit Design | F. van de Wiele (u. a.) | Taschenbuch | 876 S. | Englisch | 2012 | Springer | EAN 9789401175852 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - An Advanced Study Institute on process and device modeling for integrated circuit design was held in Louvain-la-Neuve. Belgium on July 19-29. 1977 under the auspices of the Scientific Affairs Division of NATO. The Institute was organized by a scientific organizing committee consisting of Professor F. Van de Wiele of the Universite Catholique de Louvain. Professor W. L. Engl of the Technische Hochschule Aachen and Professor P. Jespers of the Universite Catholique de Louvain. This book represents the contributions of the lecturers at the Institute and the chapters present a concise treatment of a very timely subject. namely. process and device modeling for integrated circuit design. The organization of the book parallels the program at the Institute with an introd0ction comprised of a review of mo deling and basic semiconductor physics. This is followed by the chapters devoted to basic technologies. modeling of bipolar and MoS devices. The last chapter of the book presents the specific topic of process modeling. The subject matter of this book is suitable for a wide range of interests from the advanced student. through the practisihg physicist and engineer. to the research worker. Although a novice may find some difficulty with the mathematical development. he can acquire a perspective into the field of process and device modeling for integrated circuit design with this bDOk. Likewise. portions of this book may be used as a textbook since the chap ters are intructional and self-contained.

Condition: New. In.

Condition: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.

Condition: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.

Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers advances in Negative Bias Temperature Instability (NBTI) and will prove useful to researchers and professionals in the semiconductor devices areas. NBTI continues to remain as an important reliability issue for CMOS transistors and circuits. Development of NBTI resilient technology relies on utilizing suitable stress conditions, artifact free measurements and accurate physics-based models for the reliable determination of degradation at end-of-life, as well as understanding the process, material and device architectural impacts. This book discusses: Ultra-fast measurements and modelling of parametric drift due to NBTI in different transistor architectures: planar bulk and FDSOI p-MOSFETs, p-FinFETs and GAA-SNS p-FETs, with Silicon and Silicon Germanium channels. BTI Analysis Tool (BAT), a comprehensive physics-based framework, to model the measured time kinetics of parametric drift during and after DC and ACstress, at different stress and recovery biases and temperature, as well as pulse duty cycle and frequency. The Reaction Diffusion (RD) model is used for generated interface traps, Transient Trap Occupancy Model (TTOM) for charge occupancy of the generated interface traps and their contribution, Activated Barrier Double Well Thermionic (ABDWT) model for hole trapping in pre-existing bulk gate insulator traps, and Reaction Diffusion Drift (RDD) model for bulk trap generation in the BAT framework; NBTI parametric drift is due to uncorrelated contributions from the trap generation (interface, bulk) and trapping processes. Analysis and modelling of Nitrogen incorporation into the gate insulator, Germanium incorporation into the channel, and mechanical stress effects due to changes in the transistor layout or device dimensions; similarities and differences of (100) surface dominated planar and GAA MOSFETs and (110) sidewall dominated FinFETs are analysed.

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers advances in Negative Bias Temperature Instability (NBTI) and will prove useful to researchers and professionals in the semiconductor devices areas. NBTI continues to remain as an important reliability issue for CMOS transistors and circuits. Development of NBTI resilient technology relies on utilizing suitable stress conditions, artifact free measurements and accurate physics-based models for the reliable determination of degradation at end-of-life, as well as understanding the process, material and device architectural impacts. This book discusses: Ultra-fast measurements and modelling of parametric drift due to NBTI in different transistor architectures: planar bulk and FDSOI p-MOSFETs, p-FinFETs and GAA-SNS p-FETs, with Silicon and Silicon Germanium channels. BTI Analysis Tool (BAT), a comprehensive physics-based framework, to model the measured time kinetics of parametric drift during and after DC and ACstress, at different stress and recovery biases and temperature, as well as pulse duty cycle and frequency. The Reaction Diffusion (RD) model is used for generated interface traps, Transient Trap Occupancy Model (TTOM) for charge occupancy of the generated interface traps and their contribution, Activated Barrier Double Well Thermionic (ABDWT) model for hole trapping in pre-existing bulk gate insulator traps, and Reaction Diffusion Drift (RDD) model for bulk trap generation in the BAT framework; NBTI parametric drift is due to uncorrelated contributions from the trap generation (interface, bulk) and trapping processes. Analysis and modelling of Nitrogen incorporation into the gate insulator, Germanium incorporation into the channel, and mechanical stress effects due to changes in the transistor layout or device dimensions; similarities and differences of (100) surface dominated planar and GAA MOSFETs and (110) sidewall dominated FinFETs are analysed.

Paperback. Condition: Brand New. 334 pages. 9.25x6.10x1.10 inches. In Stock.

hardcover. Condition: Good. Good. Dust Jacket NOT present. CD WILL BE MISSING. . SHIPS FROM MULTIPLE LOCATIONS. book.

Hardcover. Condition: Fine. Dust Jacket Condition: Not Issued. 1st Edition. Orange cloth, lettered in black. Proceedings of the NATO Advanced Study Institute on Process and device modeling for integrated circuit design, Louvain-la-Neuve, Belgium, 19-29 July 1977. Former owner's signature inked inside front cover, otherwise unmarked and as issued. ix,867 pp. Size: 8vo - over 7¾" - 9¾" tall. Book.

Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -An Advanced Study Institute on process and device modeling for integrated circuit design was held in Louvain-la-Neuve. Belgium on July 19-29. 1977 under the auspices of the Scientific Affairs Division of NATO. The Institute was organized by a scientific organizing committee consisting of Professor F. Van de Wiele of the Universite Catholique de Louvain. Professor W. L. Engl of the Technische Hochschule Aachen and Professor P. Jespers of the Universite Catholique de Louvain. This book represents the contributions of the lecturers at the Institute and the chapters present a concise treatment of a very timely subject. namely. process and device modeling for integrated circuit design. The organization of the book parallels the program at the Institute with an introd0ction comprised of a review of mo deling and basic semiconductor physics. This is followed by the chapters devoted to basic technologies. modeling of bipolar and MoS devices. The last chapter of the book presents the specific topic of process modeling. The subject matter of this book is suitable for a wide range of interests from the advanced student. through the practisihg physicist and engineer. to the research worker. Although a novice may find some difficulty with the mathematical development. he can acquire a perspective into the field of process and device modeling for integrated circuit design with this bDOk. Likewise. portions of this book may be used as a textbook since the chap ters are intructional and self-contained. 880 pp. Englisch.

Condition: New. Print on Demand pp. 880 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.

Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. An Advanced Study Institute on process and device modeling for integrated circuit design was held in Louvain-la-Neuve. Belgium on July 19-29. 1977 under the auspices of the Scientific Affairs Division of NATO. The Institute was organized by a scientific org.

Condition: New. PRINT ON DEMAND pp. 880.

Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -An Advanced Study Institute on process and device modeling for integrated circuit design was held in Louvain-la-Neuve. Belgium on July 19-29. 1977 under the auspices of the Scientific Affairs Division of NATO. The Institute was organized by a scientific organizing committee consisting of Professor F. Van de Wiele of the Universite Catholique de Louvain. Professor W. L. Engl of the Technische Hochschule Aachen and Professor P. Jespers of the Universite Catholique de Louvain. This book represents the contributions of the lecturers at the Institute and the chapters present a concise treatment of a very timely subject. namely. process and device modeling for integrated circuit design. The organization of the book parallels the program at the Institute with an introd0ction comprised of a review of mo deling and basic semiconductor physics. This is followed by the chapters devoted to basic technologies. modeling of bipolar and MoS devices. The last chapter of the book presents the specific topic of process modeling. The subject matter of this book is suitable for a wide range of interests from the advanced student. through the practisihg physicist and engineer. to the research worker. Although a novice may find some difficulty with the mathematical development. he can acquire a perspective into the field of process and device modeling for integrated circuit design with this bDOk. Likewise. portions of this book may be used as a textbook since the chap ters are intructional and self-contained.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 880 pp. Englisch.

Buch. Condition: Neu. Recent Advances in PMOS Negative Bias Temperature Instability | Characterization and Modeling of Device Architecture, Material and Process Impact | Souvik Mahapatra | Buch | xxiii | Englisch | 2021 | Springer Singapore | EAN 9789811661198 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.

Condition: New. Print on Demand.

Condition: New. Print on Demand.

Condition: New. PRINT ON DEMAND.

Condition: New. PRINT ON DEMAND.