Condition: New. pp. 233.
Condition: New. pp. 240.
Paperback. Condition: Brand New. rep rev edition. 248 pages. 9.25x6.10x0.56 inches. In Stock.
Published by Springer International Publishing, 2018
ISBN 10: 3319883798 ISBN 13: 9783319883793
Language: English
Seller: moluna, Greven, Germany
Condition: New.
Published by Springer International Publishing, 2017
ISBN 10: 3319671030 ISBN 13: 9783319671031
Language: English
Seller: moluna, Greven, Germany
Condition: New.
Published by Springer International Publishing, Springer International Publishing Aug 2018, 2018
ISBN 10: 3319883798 ISBN 13: 9783319883793
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Taschenbuch. Condition: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 248 pp. Englisch.
Published by Springer International Publishing, Springer International Publishing Sep 2017, 2017
ISBN 10: 3319671030 ISBN 13: 9783319671031
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Buch. Condition: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 248 pp. Englisch.
Published by Springer International Publishing, Springer International Publishing, 2018
ISBN 10: 3319883798 ISBN 13: 9783319883793
Language: English
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016. The 11 papers included in the book were carefully reviewed and selected from the 36 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design.
Published by Springer International Publishing, 2017
ISBN 10: 3319671030 ISBN 13: 9783319671031
Language: English
Seller: AHA-BUCH GmbH, Einbeck, Germany
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016. The 11 papers included in the book were carefully reviewed and selected from the 36 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design.
Published by Springer International Publishing, 2018
ISBN 10: 3319883798 ISBN 13: 9783319883793
Language: English
Seller: preigu, Osnabrück, Germany
Taschenbuch. Condition: Neu. VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability | 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers | Thomas Hollstein (u. a.) | Taschenbuch | xiv | Englisch | 2018 | Springer International Publishing | EAN 9783319883793 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Hardcover. Condition: New. New. book.
Paperback. Condition: New. New. book.
Published by Springer International Publishing Aug 2018, 2018
ISBN 10: 3319883798 ISBN 13: 9783319883793
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016. The 11 papers included in the book were carefully reviewed and selected from the 36 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. 248 pp. Englisch.
Published by Springer International Publishing Sep 2017, 2017
ISBN 10: 3319671030 ISBN 13: 9783319671031
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016. The 11 papers included in the book were carefully reviewed and selected from the 36 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. 248 pp. Englisch.
Condition: New. Print on Demand pp. 233.
Condition: New. Print on Demand pp. 240.
Condition: New. PRINT ON DEMAND pp. 233.
Condition: New. PRINT ON DEMAND pp. 240.
Published by Springer International Publishing, 2017
ISBN 10: 3319671030 ISBN 13: 9783319671031
Language: English
Seller: preigu, Osnabrück, Germany
Buch. Condition: Neu. VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability | 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers | Thomas Hollstein (u. a.) | Buch | xiv | Englisch | 2017 | Springer International Publishing | EAN 9783319671031 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.