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Vlsi Systems Chip Ifip by Luis Miguel (8 results)
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VLSI: Systems on a Chip: IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI - 99) December 1-4, 1999, Lisboa, . in Information and Communication Technology)
Seller: Zubal-Books, Since 1961, Cleveland, OH, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. 678 pp., Hardcover, ex library, else text and binding clean and tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
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VLSI: Systems on a Chip : IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI '99) December 1-4, 1999, Lisboa, Portugal
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 63.68
Convert currencyUS$ 16.23 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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US$ 230.98
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US$ 231.21
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VLSI: Systems on a Chip: IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI '99) December 1-4, 1999, Lisboa, ... Information and Communication Technology, 34)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 266.90
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VLSI: Systems on a Chip: IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI '99) December 1-4, 1999, Lisboa, ... in Information and Communication Technology)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 266.90
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VLSI: Systems on a Chip : IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI '99) December 1-4, 1999, Lisboa, Portugal
Published by Springer US, Springer US, 2013
ISBN 10: 1475710143 ISBN 13: 9781475710144
Language: English
US$ 258.07
Convert currencyUS$ 37.89 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - For over three decades now, silicon capacity has steadily been doubling every year and a half with equally staggering improvements continuously being observed in operating speeds. This increase in capacity has allowed for more complex systems to be built on a single silicon chip. Coupled with this functionality increase, speed improvements have fueled tremendous advancements in computing and have enabled new multi-media applications. Such trends, aimed at integrating higher levels of circuit functionality are tightly related to an emphasis on compactness in consumer electronic products and a widespread growth and interest in wireless communications and products. These trends are expected to persist for some time as technology and design methodologies continue to evolve and the era of Systems on a Chip has definitely come of age. While technology improvements and spiraling silicon capacity allow designers to pack more functions onto a single piece of silicon, they also highlight a pressing challenge for system designers to keep up with such amazing complexity. To handle higher operating speeds and the constraints of portability and connectivity, new circuit techniques have appeared. Intensive research and progress in EDA tools, design methodologies and techniques is required to empower designers with the ability to make efficient use of the potential offered by this increasing silicon capacity and complexity and to enable them to design, test, verify and build such systems.
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US$ 356.11
Convert currencyUS$ 13.55 shipping from United Kingdom to U.S.A.Quantity: 2 available
Add to basketPaperback. Condition: Brand New. 700 pages. 9.25x6.10x1.57 inches. In Stock.
