IC chip packaging technology ( 2nd Edition ) application personnel training colleges planning materials(Chinese Edition)
Language: Chinese
Published by 电子工业出版社, 2013
- Softcover
- New
Condition: New
US$ 65.25
Quantity: 1 available
Add to basketItem description from seller
Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2013-07-01 Pages: 252 Language: Chinese Publisher: Electronic Industry Press IC chip packaging technology ( 2nd Edition ) Applied Talents universities planning materials is a general-purpose integrated circuits chip packaging technology materials. The book has 13 chapters. including integrated circuit chip package overview. packaging process. thick film technology . welding materials. printed circuit boards. components and circuit board bonding . sealing plastic materials.Four Satisfaction guaranteed,or money back.
Seller Inventory # BR077070
Bibliographic details
- Title
- IC chip packaging technology ( 2nd Edition ) application personnel training colleges planning materials(Chinese Edition)
- Author
- LI KE WEI
- Publisher
- 电子工业出版社
- Publication year
- 2013
- Condition
- New
- Binding
- paperback
- Language
- Chinese
- ISBN 10
- 7121206498
- ISBN 13
- 9787121206498
Shipping rates from China to U.S.A.
| Item | 16 to 30 business days | 8 to 16 business days |
|---|---|---|
| First item | US$ 18.00 | US$ 30.00 |
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NAN JING SHI JIANG NING QU NING YUAN DIAN ZI SHANG WU ZHONG XIN
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Nanjing, JS China 211100
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