Electronics Packaging Forum - Multichip Module Technology Issues

James E. Morris (Editor)

ISBN 10: 078030439X ISBN 13: 9780780304390

Published by IEEE Press, Piscataway, NJ, 1993

Language: English

Condition: Used Hardcover

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Hard pictorial covers, an as new copy, pp vii,392. Text figures and tables throughout. Size: 16x24cm.

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Bibliographic Details

Title

Electronics Packaging Forum - Multichip Module Technology Issues

Publisher

IEEE Press, Piscataway, NJ

Publication Date

1993

Language

English

ISBN 10

078030439X

ISBN 13

9780780304390

Binding

Hard Cover

Edition

First Edition.

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Synopsis

Based on presentations at the Electronics Packaging Symposium, held at the State University of New York, Binghamton in May 1991, this practical volume provides a multidisciplinary treatment of the field of electronic packaging and multichip modules. Among the topics covered: building long-term reliability by increasing polyimide stability; recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical processes; how to use the finite-difference time-domain approach in electromagnetic modeling; and the development of dedicated test chips for package evaluation in varied field conditions. Annotation copyright Book News, Inc. Portland, Or.

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