Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems)

Book Information Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.

Muhanned S. Bakir is a research engineer at the Microelectronics Research Center and adjunct professor in the School of Electrical and Computer Engineering at Georgia Institute of Technology. He has published more than 50 refereed and invited publications in conference proceedings and journals. Dr. Bakir received the Ph.D. in electrical and computer engineering from Georgia Institute of Technology.

James D. Meindl is the director of the Joseph M. Pettit Microelectronics Research Center and is the founding director of the Nanotechnology Research Center at Georgia Institute of Technology, where he is also the Joseph M. Pettit Chair Professor of Microsystems. Prior to his tenure at Georgia Tech, he served as senior vice president for academic affairs and provost of Rensselaer Polytechnic Institute. Dr. Meindl received his Ph.D. in electrical engineering at Carnegie Institute of Technology (Carnegie-Mellon University) and is a Fellow of IEEE and the American Association for the Advancement of Science.