Report of the Third Workshop Program for X-Ray Lithography Development November 17-18, 1986; BNL 52046

[4], 66, [2] pages. Tables. Figures. Fold-out. Oversized book, measuring 11 inches by 8-1/2 inches. Cover has slight wear and soiling. Includes Executive Summary; Introduction; X-Ray Lithography Program; Cost Estimate; Schedule; and Management Plan. Also includes four appendices: List of Participants; Workshop Agenda; Room Temperature Compact Synchrotron; and Equipment for 0.25 Micron Lithography Pilot Line. The purpose of this workshop is to develop a preliminary program plan for a national research, development, and demonstration activity with the goal of a commercial 0.25 micron x-ray lithography manufacturing capability by 1995. The plan incorporates estimated costs and schedules, and includes a proposed management plan for the program. The costs, schedules, and management plan presented here are aimed at putting in place a facility capable of housing both a conventional and a superconducting magnet ring. This document identifies a plan aimed at restoring U.S. leadership in the manufacture of high density computer chips in the 1990's. Specifically, its focuses on key R&D elements aimed at o.25 micron x-ray lithography manufacturing capability by 1995. the opportunity, definition and scope of this initiative was established in two previous workshops. The plan is a response to the need for minimum feature sizes of 0.25 micron and Dynamic Random Access Memories (DRAMs) of 256 Megabits in the 1990's. Optical methods cannot achieve the needed resolution and electron beam writing is severely limited in speed. The plan presents a unique collaboration combining integrated circuit process technology from industry and accelerator technology from national laboratories.…