Solder Paste in Electronics Packaging : Technology and Applications in Surface Mount, Hybrid Circuits, and Component Technology

Language: English

Published by Van Nostrand Reinhold, New York, 1992

0442013531 / 9780442013530

  • First Edition
  • Softcover
  • Used
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Seller: Book Booth, Berea, OH, U.S.A.Book Booth

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Softcover

Condition: Used - Good

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Item description from seller

minor shelf wear and cover soil, corners lightly bumped, former owners name inside front cover, xxii + 456 pages including appendix and index, covers chemical and physical characteristics, metallurgy, rheology of pastes, soldering methods and application techniques, cleaning, reliability and quality control, testing and related topics, bw illustrations Size: 6 x 9.

Seller Inventory # 006392

Title
Solder Paste in Electronics Packaging : Technology and Applications in Surface Mount, Hybrid Circuits, and Component Technology
Author
Hwang, Jennie S.
Publisher
Van Nostrand Reinhold, New York
Publication year
1992
Condition
Good
Binding
Paperback
Language
English
ISBN 10
0442013531
ISBN 13
9780442013530
Edition
First Paperback Edition.
Seller catalogs
Science/Technology/Construction

Book Booth

Berea, OH, U.S.A.

5-star seller

AbeBooks seller since January 3, 2002

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