Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)

Cepeda-rizo, Juan; Gayle, Jeremiah; Ravich, Joshua

ISBN 10: 1032160810 ISBN 13: 9781032160818
Published by CRC Press, 2022
Language: English
Condition: Used - Very good Hardcover

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Used - Hardcover

Condition: Used - Very good

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