1989 HC Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Language: English
Published by Intl Society of Hybrid, 1989
- Hardcover
- Used
Seller: Miki Store, San Jose, CA, U.S.A.Miki Store
AbeBooks seller since December 14, 2023
Condition: Used - Very good
US$ 28.99
Quantity: 1 available
Add to basketItem description from seller
Pages are crisp and clean, no marking. Cover is verygood. Binding is tight/good.
Seller Inventory # hb-bs23
- Title
- 1989 HC Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
- Author
- Harman, George
- Publisher
- Intl Society of Hybrid
- Publication year
- 1989
- Condition
- Very Good
- Dust jacket
- DUST JACKET
- Binding
- hardcover
- Language
- English
- ISBN 10
- 0930815254
- ISBN 13
- 9780930815257
- Item weight
- 32 ounces
- Dimensions
- 6x1x9
"Synopsis" may belong to another edition of this title.
Miki Store
San Jose, CA, U.S.A.
AbeBooks seller since December 14, 2023
Shipping rates within U.S.A.
| Item | 3 to 9 business days | 2 to 5 business days |
|---|---|---|
| First item | US$ 6.05 | US$ 25.00 |
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Miki Store
CA, U.S.A.
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Shipping terms
Shipping:
Handling time: same day
Delivery time: 1-3 days with tracking numbers.
Please provide me your correct deliver address. I will not take responsibility if You provided wrong address