Silicon Devices and Process Integration (INTERNATIONAL CONFERENCE ON PHONON SCATTERING IN SOLIDS// PROCEEDINGS) - Softcover

El-Kareh, Badih

Softcover

ISBN 10: 0387563954 ISBN 13: 9780387563954

Publisher: Springer, 2009

Synopsis

This volume contains the proceedings of the Seventh International Conference on Phonon Scattering in Condensed Matter held August 3-7, 1992, at Cornell University in Ithaca, NY, USA. The preceding conferences were held at: St. Maxime and Paris (France) 1972, Nottingham (UK) 1975, Providence (USA) 1979, Stuttgart (Germany) 1983, Urbana (USA) 1986, and Heidelberg (Germany) 1989. The Heidelberg conference was held jointly with the Third International Con­ ference on Phonon Physics. The next conference, to be held in August, 1995, in Sapporo, Japan, and hosted by Professor T. Nakayama and his colleagues, will also be such a joint conference. This conference was attended by 227 scientists from 27 countries, and covered all aspects of phonon scattering in condensed matter, ranging from the more traditional topics of thermal conductivity, Kapitza resistance, and ballistic phonon propagation to the recently added topics, such as electron-phonon interaction in high-T c superconductors, the use of phonons in particle detection, and phonons in confined geometries. The 207 papers arranged in 11 chapters in this volume are a cross section of the present activities in the quite obviously vibrant field of phonons and their interactions.

Edition details

• Publisher: Springer
• Publication date: 2009
• ISBN 10: 0387563954
• ISBN 13: 9780387563954
• Binding: Paperback
• Language: English
• Number of pages: 624