Items related to Microelectronics Packaging Handbook, Part 2: Semiconductor...
Synopsis
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
"synopsis" may belong to another edition of this title.
Review
`A most comprehensive book set, both well presented and well illustrated.'
IEEE Electrical Insulation Magazine, September/October 1997
"About this title" may belong to another edition of this title.
Search results for Microelectronics Packaging Handbook, Part 2: Semiconductor...
Stock Image
Microelectronics Packaging Handbook: Semiconductor Packaging (Volume 2)
Seller: Anybook.com, Lincoln, United Kingdom
Seller rating 5 out of 5 stars
Condition: Good. Volume 2. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1650grams, ISBN:9780412084416. Seller Inventory # 5582661
Quantity: 1 available
Seller Image
Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
Seller: 2nd Life Books, Burlington, NJ, U.S.A.
Seller rating 5 out of 5 stars
Condition: acceptable. A readable copy. All pages are intact, and the cover is intact. Dust jacket may be missing. Pages can include considerable highlighting markings writing but cannot obscure the text. May be an Ex-lib. copy and have standard library stamps and or stickers. May NOT include discs, or access code or other supplemental material. We ship Monday-Saturday and respond to inquiries within 24 hours. Seller Inventory # BXM.8DPG
Quantity: 1 available
Stock Image
Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Second Edition)
Published by
Chapman & Hall, New York, 1997
ISBN 10: 0412084414
ISBN 13: 9780412084416
Used
Hardcover
Seller: Moe's Books, Berkeley, CA, U.S.A.
Seller rating 4 out of 5 stars
Hard cover. Condition: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked. Seller Inventory # 1148741
Quantity: 1 available
Seller Image
Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
Published by
Springer-Verlag Publishing, 1997
ISBN 10: 0412084414
ISBN 13: 9780412084416
Used
Hardcover
Seller: Salish Sea Books, Bellingham, WA, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. 2. Good+; Hardcover; Former corporate library copy with company stamp to the right textblock edge, inside each cover, and to the first and last endpapers; Covers are clean and glossy; Text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Purple and orange covers with title in white and yellow lettering; 2nd Edition; 1997, Springer-Verlag Publishing; 1030 pages; "Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging," by R.R. Tummala, et al. Seller Inventory # SKU-0475AF02103032
Quantity: 1 available
Stock Image
Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
Seller: Toscana Books, AUSTIN, TX, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks. Seller Inventory # Scanned0412084414
Quantity: 1 available
Seller Image
Microelectronics Packaging Handbook
Print on DemandSeller: moluna, Greven, Germany
Seller rating 5 out of 5 stars
Bundle. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kon. Seller Inventory # 5914106
Quantity: Over 20 available
Stock Image
Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In. Seller Inventory # ria9780412084416_new
Quantity: Over 20 available
Seller Image
Microelectronics Packaging Handbook
Print on DemandSeller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. 1072 pp. Englisch. Seller Inventory # 9780412084416
Quantity: 2 available
Seller Image
Microelectronics Packaging Handbook : Semiconductor Packaging
Published by
Springer US, Springer New York, 1997
ISBN 10: 0412084414
ISBN 13: 9780412084416
New
Hardcover
Seller: AHA-BUCH GmbH, Einbeck, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. Seller Inventory # 9780412084416
Quantity: 1 available
Seller Image
Microelectronics Packaging Handbook
Published by
Springer US, Springer New York Jan 1997, 1997
ISBN 10: 0412084414
ISBN 13: 9780412084416
New
Hardcover
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. Neuware -Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 1072 pp. Englisch. Seller Inventory # 9780412084416
Quantity: 2 available