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Synopsis
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.
Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
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Review
`A most comprehensive book set, both well presented and well illustrated.'
IEEE Electrical Insulation Magazine, September/October 1997
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
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Condition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings With owner's name inside cover. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1100grams, ISBN:9780412084515. Seller Inventory # 9755917
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Microelectronics Packaging Handbook: Subsystem Packaging (Volume 3)
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Condition: Good. Volume 3. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:9780412084515. Seller Inventory # 5582662
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
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Microelectronics Packaging Handbook : Subsystem Packaging
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
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Microelectronics Packaging Handbook (Hardcover)
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Chapman and Hall, London, 1997
ISBN 10: 0412084511
ISBN 13: 9780412084515
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Hardcover. Condition: new. Hardcover. This text is the third of three volumes to update the author's earlier one-volume "Microelectronics Handbook", first published in 1988. Revised to incorporate advances in the industry, this volume provides a balance of theory and practical applications. It explains the latest in microelectronics design methods, modelling tools, simulation techniques and manufacturing procedures. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Seller Inventory # 9780412084515
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
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