Synopsis
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
"synopsis" may belong to another edition of this title.
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Seller Inventory # S_467517004
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Chip on Board: Technology for Multichip Modules
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering) [Hardcover] Lau, John H.
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
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Chip On Board
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Chip On Board
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Chip on Board: Technology for Multichip Modules
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Gebunden. Condition: New. This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and. Seller Inventory # 458435639
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Chip On Board
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Condition: New. PRINT ON DEMAND pp. 580. Seller Inventory # 181810858
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Chip on Board : Technology for Multichip Modules
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Buch. Condition: Neu. Neuware - This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection. Seller Inventory # 9780442014414
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