Items related to Microelectronics Packaging Handbook
Synopsis
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.
Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
"synopsis" may belong to another edition of this title.
About the Author
Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.
"About this title" may belong to another edition of this title.
Search results for Microelectronics Packaging Handbook
Stock Image
Microelectronics Packaging Handbook
Seller: HPB-Emerald, Dallas, TX, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority! Seller Inventory # S_438913286
Quantity: 1 available
Stock Image
Microelectronics Packaging Handbook
Seller: HPB-Red, Dallas, TX, U.S.A.
Seller rating 5 out of 5 stars
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Seller Inventory # S_406158836
Quantity: 1 available
Stock Image
Microelectronics Packaging Handbook
Seller: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.9. Seller Inventory # G0442205783I3N00
Quantity: 1 available
Stock Image
Microelectronics Packaging Handbook
Seller: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Good. No Jacket. Missing dust jacket; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.9. Seller Inventory # G0442205783I3N01
Quantity: 1 available
Stock Image
Microelectronics Packaging Handbook
Seller: ThriftBooks-Phoenix, Phoenix, AZ, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.9. Seller Inventory # G0442205783I3N00
Quantity: 1 available
Stock Image
Microelectronics Packaging Handbook
Seller: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.9. Seller Inventory # G0442205783I3N00
Quantity: 1 available
Stock Image
Microelectronics Packaging Handbook
Seller: Wonder Book, Frederick, MD, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. Good condition. Good dust jacket. A copy that has been read but remains intact. May contain markings such as bookplates, stamps, limited notes and highlighting, or a few light stains. NOT AVAILABLE FOR SHIPMENT OUTSIDE OF THE UNITED STATES. Seller Inventory # I10B-00858
Quantity: 1 available
Stock Image
Microelectronic Packaging Handbook
Published by
Wiley & Sons, Incorporated, John, 1989
ISBN 10: 0442205783
ISBN 13: 9780442205782
Used
Hardcover
First Edition
Seller: Better World Books, Mishawaka, IN, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. 1st Edition. Used book that is in clean, average condition without any missing pages. Seller Inventory # 9707452-75
Quantity: 1 available
Stock Image
Microelectronic Packaging Handbook
Published by
Wiley & Sons, Incorporated, John, 1989
ISBN 10: 0442205783
ISBN 13: 9780442205782
Used
Hardcover
First Edition
Seller: Better World Books, Mishawaka, IN, U.S.A.
Seller rating 5 out of 5 stars
Condition: Very Good. 1st Edition. Used book that is in excellent condition. May show signs of wear or have minor defects. Seller Inventory # GRP105030299
Quantity: 1 available
Stock Image
Microelectronics Packaging Handbook
Seller: A Squared Books (Don Dewhirst), South Lyon, MI, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Very Good. New York, 1988; black leather like cloth covered boards; corners and spine edges mildly scuffed; illustrated jacket with mild edge wear; 8vo, 7 3/4"-9 3/4" tall; "ADI Engineering Library" stamp on free front end paper, no other library markings; Interior is clean and unmarked; 1194 pages. Additional shipping charges may need to be requested due to size or weight of book. Seller Inventory # SKU1149536
Quantity: 1 available