Items related to Microelectronics Packaging Handbook
Synopsis
Explains the latest design methods, modeling tools, simulation techniques, and manufacturing procedures of microelectronics packaging
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About the Author
Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.
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- PublisherSpringer
- Publication date1988
- ISBN 10 0442205783
- ISBN 13 9780442205782
- BindingHardcover
- LanguageEnglish
- Edition number1
- Number of pages1194
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Microelectronics Packaging Handbook
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Microelectronics Packaging Handbook
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Microelectronics Packaging Handbook
Published by
Van Nostrand Reinhold Company, 1988
ISBN 10: 0442205783
ISBN 13: 9780442205782
Used
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Hardcover. Condition: Fair. No Jacket. Former library book; Missing dust jacket; Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less 3.9. Seller Inventory # G0442205783I5N11
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Microelectronics Packaging Handbook
Seller: A Squared Books (Don Dewhirst), South Lyon, MI, U.S.A.
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Hardcover. Condition: Very Good. New York, 1988; black leather like cloth covered boards; corners and spine edges mildly scuffed; illustrated jacket with mild edge wear; 8vo, 7 3/4"-9 3/4" tall; "ADI Engineering Library" stamp on free front end paper, no other library markings; Interior is clean and unmarked; 1194 pages. Additional shipping charges may need to be requested due to size or weight of book. Seller Inventory # SKU1149536
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Microelectronics Packaging Handbook
Published by
Kluwer Academic Publishers, 1988
ISBN 10: 0442205783
ISBN 13: 9780442205782
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Hardcover
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Microelectronics Packaging HandBook
Published by
Van Nostrand Reinhold, New York NY, 1989
ISBN 10: 0442205783
ISBN 13: 9780442205782
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Hardcover
First Edition
Seller: Longs Peak Book Company, Loveland, CO, U.S.A.
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Hardcover. Condition: Near Fine. 1st Edition. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. This copy is in excellent condition, a second printing of the first edition, a hardback with no dustjacket . Given the book's size and weight--3# 13oz-- shipping charges will be adjusted.The book will be carefully wrapped and boxed for safe shipping. Seller Inventory # 003422
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Microelectronics Packaging Handbook
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Microelectronics Packaging Handbook
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title! Seller Inventory # Q-0442205783
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Microelectronics Packaging Handbook
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Microelectronics Packaging Han
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