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Synopsis
Explains the latest design methods, modeling tools, simulation techniques, and manufacturing procedures of microelectronics packaging
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About the Author
Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.
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Microelectronics Packaging Handbook
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Seller Inventory # S_348930292
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Microelectronics Packaging Handbook
Seller: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
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Hardcover. Condition: Good. No Jacket. Former library book; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. Seller Inventory # G0442205783I3N10
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Microelectronic Packaging Handbook
Published by
Wiley & Sons, Incorporated, John, 1989
ISBN 10: 0442205783
ISBN 13: 9780442205782
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Hardcover
First Edition
Seller: Better World Books, Mishawaka, IN, U.S.A.
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Condition: Good. 1st Edition. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Seller Inventory # 9707452-75
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Microelectronics Packaging Handbook
Seller: -OnTimeBooks-, Phoenix, AZ, U.S.A.
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Condition: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail. Seller Inventory # OTV.0442205783.G
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Microelectronics Packaging Handbook
Seller: -OnTimeBooks-, Phoenix, AZ, U.S.A.
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Condition: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships USPS Media Mail. Seller Inventory # OTV.0442205783.VG
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Microelectronics Packaging Handbook
Seller: A Squared Books (Don Dewhirst), South Lyon, MI, U.S.A.
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Hardcover. Condition: Very Good. New York, 1988; black leather like cloth covered boards; corners and spine edges mildly scuffed; illustrated jacket with mild edge wear; 8vo, 7 3/4"-9 3/4" tall; "ADI Engineering Library" stamp on free front end paper, no other library markings; Interior is clean and unmarked; 1194 pages. Additional shipping charges may need to be requested due to size or weight of book. Seller Inventory # SKU1149536
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Microelectronics Packaging Handbook
Published by
Kluwer Academic Publishers, 1987
ISBN 10: 0442205783
ISBN 13: 9780442205782
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Hardcover. Condition: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. A few small marks or stains to the page edges/pages . Previous owners name inside the front page/cover. Seller Inventory # rev2723883316
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Microelectronics Packaging Handbook
Seller: BookDepart, Shepherdstown, WV, U.S.A.
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Hardcover. Condition: UsedVeryGood. Hardback with dust jacket. Light shelf wear to exterior; discard stamp on e xterior bottom page edge; former owner's name blacked out at top of exterio r page edge; former owner's name written on front end page; otherwise in ve ry good condition with clean text, firm binding. Dust jacket, light fading, light shelf wear. Seller Inventory # 73848
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Microelectronics Packaging Handbook
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Microelectronics Packaging Handbook
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title! Seller Inventory # Q-0442205783