Advanced Electronic Packaging

ISBN 13: 9780471466093

Advanced Electronic Packaging

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9780471466093: Advanced Electronic Packaging
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As in the First Edition, each chapter in this new SecondEdition is authored by one or more acknowledged experts andthen carefully edited to ensure a consistent level of quality andapproach throughout. There are new chapters on passive devices, RFand microwave packaging, electronic package assembly, and costevaluation and assembly, while organic and ceramic substrates arenow covered in separate chapters. All the hallmarks of the FirstEdition, which became an industry standard and a populargraduate-level textbook, have been retained.

An Instructor's Manual presenting detailed solutions to all theproblems in the book is available upon request from the WileyMakerting Department.

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From the Back Cover:

Advanced Electronic Packaging, Second Editionreflects the changes in the electronic packaging industry, as wellas feedback from students, engineers, and educators since thepublication of the First Edition in 1999. Like the First Edition,each chapter is authored by one or more acknowledged experts andthen carefully edited to ensure a consistent level of quality andapproach throughout.

Readers familiar with the First Edition will note severalkey changes. For example, organic and ceramic substrates are nowcovered in separate chapters. There are new chapters on passivedevices, RF and microwave packaging, electronic package assembly,and cost evaluation and assembly. In addition, readers have accessto the latest information and findings in such topics as:

  • Packaging materials and applications
  • Modeling and simulations
  • Analytical techniques for materials
  • MEMS packaging
  • Fabrication technologies and package design
  • Reliability
  • Electrical, mechanical, and thermal considerations
  • Three-dimensional packaging

All the hallmarks of the First Edition, which became anindustry standard and a popular graduate-level textbook, have beenretained. Examples illustrate real-world applications, which arethen reinforced by the extensive use of exercises to enable readersthemselves to place their newfound knowledge into practice. Inaddition, references are provided that guide readers to morein-depth information and primary resources in specializedtopics.

Fully updated, this comprehensive reference remains thepreeminent graduate-level textbook in its field as well as anessential reference for engineers and scientists.

About the Author:

Richard K. Ulrich is a professor of chemical engineering atthe University of Arkansas. He is a book editor and columnist onembedded passive technology, a NEMI committee member, an associateeditor of IEEE Transactions on Advanced Packaging, and pastchairman of chairman of the Dielectric Science and TechnologyDivision of the Electrochemical Society.

WILLIAM D. BROWN, PhD, is Associate Dean for Research,College of Engineering, and Distinguished Professor of ElectricalEngineering, University of Arkansas. Since 1991, he has played anactive role in sponsoring and guiding research at the University'sHigh Density Electronics Center (HiDEC), which is dedicated toadvancing the state of the art in electronics packaging materialsand technologies.

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Book Description John Wiley and Sons Ltd, United Kingdom, 2006. Hardback. Condition: New. 2nd Edition. Language: English . Brand New Book. As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor s Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department. Seller Inventory # AAH9780471466093

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Book Description John Wiley and Sons Ltd, United Kingdom, 2006. Hardback. Condition: New. 2nd Edition. Language: English . Brand New Book. As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor s Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department. Seller Inventory # AAH9780471466093

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Richard K. Ulrich (editor), William D. Brown (editor)
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