Advanced Electronic Packaging (89 results)

- Hardcover
Seller: HPB-Red, Dallas, TX, U.S.A.HPB-Red
Contact seller5-star sellerCondition: Used - Good
US$ 23.98
US$ 3.75 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

- Hardcover
Seller: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.ThriftBooks-Atlanta
Contact seller5-star sellerCondition: Used - Very good
US$ 27.97
Free ShippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

- Hardcover
Seller: BooksRun, Philadelphia, PA, U.S.A.BooksRun
Contact seller5-star sellerCondition: Used - Very good
US$ 38.19
Free ShippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Very Good. 2. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.

- Hardcover
Seller: World of Books (was SecondSale), Montgomery, IL, U.S.A.World of Books (was SecondSale)
Contact seller5-star sellerCondition: Used - Good
US$ 38.54
Free ShippingShips within U.S.A.Quantity: 1 available
Hardback. Condition: Good. This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.…

- Hardcover
Seller: World of Books Inc, Montgomery, IL, U.S.A.World of Books Inc
Contact seller4-star sellerCondition: Used - Good
US$ 40.54
Free ShippingShips within U.S.A.Quantity: 1 available
Hardback. Condition: Good. This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.…

- Hardcover
Seller: ThriftBooks-Dallas, Dallas, TX, U.S.A.ThriftBooks-Dallas
Contact seller5-star sellerCondition: Used - Fair
US$ 40.72
Free ShippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

- Hardcover
Seller: Broad Street Books, Branchville, NJ, U.S.A.Broad Street Books
Contact seller5-star sellerCondition: Used - Very good
US$ 39.95
US$ 4.95 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Very Good. Book is in very nice condition, text is unmarked and pages are tight.

- Hardcover
Seller: Zephyr Books LLC, Reno, NV, U.S.A.Zephyr Books LLC
Contact seller5-star sellerCondition: Used - Very good
US$ 38.50
US$ 6.45 shippingShips within U.S.A.Quantity: 1 available
Condition: Very Good. Heavy book, requires extra postage. A very good plus copy, no dustjacket. 8vo. xxxii, 789 pp. Hardcover, glossy pictorial boards.

- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 118.70
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Advanced Mems Packaging (electronic Engineering)
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
US$ 120.27
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Language: English
Published by World Scientific Pub Co Inc, 2017
Series: Book 4 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 132.80
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Language: English
Published by World Scientific Pub Co Inc, 2017
Series: Book 4 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
US$ 134.56
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
US$ 135.81
US$ 6.95 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: New. In shrink wrap. Looks like an interesting title.

Language: English
Published by World Scientific Publishing Company, Incorporated, 2012
Series: Book 1 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: Used
US$ 147.43
US$ 3.99 shippingShips within U.S.A.Quantity: 1 available
Condition: Used. pp. 440.

Language: English
Published by World Scientific Publishing Company, Incorporated, 2012
Series: Book 1 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: Used
US$ 151.68
US$ 8.63 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: Used. pp. 440.

Language: English
Published by World Scientific Publishing Company, Incorporated, 2012
Series: Book 1 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: Used
US$ 160.05
US$ 11.16 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Used. pp. 440.

Language: English
Published by World Scientific Pub Co Inc, 2017
Series: Book 4 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 179.61
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

- Softcover
Seller: liu xing, Nanjing, JS, Chinaliu xing
Contact seller5-star sellerCondition: New
US$ 169.42
US$ 18.00 shippingShips from China to U.S.A.Quantity: 1 available
paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of electronic packaging technologies. including important packaging fundamentals such as wire bonding. automatic tape bonding. flip chip solder joint bonding. microbump bonding. and CUCU direct bonding. Part II introduces the circuit desi.…

- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller5-star sellerCondition: New
US$ 188.00
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.

Language: English
Published by World Scientific Pub Co Inc, 2017
Series: Book 4 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: Used
US$ 191.00
US$ 3.99 shippingShips within U.S.A.Quantity: 1 available
Condition: Used. pp. 550 Second edition NO-PA16APR2015-KAP.

Language: English
Published by Springer, 2011
Series: Book 28 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: StainesBookhub, Weybridge, SURRE, United KingdomStainesBookhub
Contact seller2-star sellerCondition: New
US$ 158.40
US$ 39.81 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

- Hardcover
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
Contact seller5-star sellerCondition: New
US$ 197.42
US$ 12.42 shippingShips from United Kingdom to U.S.A.Quantity: 15 available
HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.

- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 189.98
US$ 19.91 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.

Language: English
Published by World Scientific Pub Co Inc, 2017
Series: Book 4 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: Used
US$ 197.75
US$ 8.63 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: Used. pp. 550.

- Hardcover
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
US$ 199.85
US$ 15.14 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new.

- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 206.54
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.

- Hardcover
Seller: DeckleEdge LLC, Albuquerque, NM, U.S.A.DeckleEdge LLC
Contact seller5-star sellerCondition: New
US$ 209.35
Free ShippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: new.

- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 209.99
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.

Language: English
Published by World Scientific Pub Co Inc, 2017
Series: Book 4 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: Used
US$ 212.33
US$ 11.16 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Used. pp. 550.

- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 215.19
US$ 14.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In English.