Presents an up-to-date, pragmatic overview of packaging and interconnect technology from the perspective of workers in the field, as a reference for practicing engineers in both microelectronic packaging and in general electronic system design, or as a supplemental text at the advanced undergraduate or graduate level, assuming previous exposure to the fundamental engineering sciences (mechanics, electromagnetics, heat transfer, and materials science). It emphasizes the interaction and trade-offs required across the various disciplines in the realization of effective product designs. Annotation copyright Book News, Inc. Portland, Or.
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Addresses the requirements of engineers concerned with electronic production design and manufacturing where there is a need to reduce product design cycles and manufacturing costs, shorten the size of electronic components and assure reliability. Coverage includes background material on basic chip and computer architecture and the integration of mechanical and engineering considerations; stress, vibration and acoustics; material selection (ceramics, glass and metals); manufacturing, assembly and surface mount technology and much more. Features an extensive reference data section of pertinent information currently scattered throughout other sources.
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