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Pecht Michael (571 results)
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Condition: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item for full refund. Ships USPS Media Mail.
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Hardcover. Condition: Fair. No Jacket. 1st Edition. This book is seriously flawed by the fact that pages 289 to 307 function as an insert. They are completely separated from the binding. But the book is all there and is otherwise in new condition. There are no tears or signs of wear to the clean pages or the cover.
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Hardcover. Condition: with no dust jacket. Dust Jacket Condition: No Dust Jacket. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Slight spine twist. Pages clean, but for library markings. ; TEH22B; 413 pages; Ex-Library.
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Condition: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Paperback. Condition: As New. No Jacket. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less.
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Guidebook for Managing Silicon Chip Reliability (Electronic Packaging Series)
Book 2 of 4: Electronic PackagingSeller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Seller rating 4 out of 5 stars
Condition: acceptable. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Acceptable condition! Any other included accessories are also in Acceptable condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear such as cover tears discoloration, staining, marks, scuffs, etc. All pages intact.
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Hardcover. Condition: Très bon. Ancien livre de bibliothèque. Edition 1996. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Very good. Former library book. Edition 1996. Ammareal gives back up to 15% of this item's net price to charity organizations.
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Engineering for Social Change
Seller: Bay State Book Company, North Smithfield, RI, U.S.A.
Seller rating 5 out of 5 stars
Condition: very_good.
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Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications
Language: English
Published by John Wiley & Sons, NY, 1995
ISBN 10: 0471306258 ISBN 13: 9780471306252
Condition: Very Good. Hardcover, [xxxiv], 474 pages. Very Good condition/no dust jacket. Ex-library. Size 9.5"x6.5". "For the first time between two covers, here is a comprehensive, critical review of the state of the art in PEMs and assemblies that incorporate them. The most timely book on the subject, it provides professionals with a systematic, scientific exploration of crucial technical and reliability issues concerning the manufacture and use of PEMs - with special attention focusing on environment-specific applications." Library stamp on front pastedown & title page, previous owner's name on front & rear pastedowns, else Near Fine condition, clean and unmarked.
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Hardcover. Condition: Very Good. Dust Jacket Condition: No Dust Jacket. 1st Edition. Name of previous owner in ink inside front board. Otherwise copy is clean and unmarked in very good condition. 214 pages.
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Guidebook for Managing Silicon Chip Reliability. (=Electronic Packaging Series).
Language: English
Published by Taylor & Francis Inc., 1998
Seller: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Germany
Association Member: GIAQ
Seller rating 5 out of 5 stars
Hardcover. Condition: Wie neu. 224 S.; Ill. Like new. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 655.
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Guidebook for Managing Silicon Chip Reliability
Book 2 of 4: Electronic PackagingLanguage: English
Published by Taylor & Francis Group, 1998
ISBN 10: 0849396247 ISBN 13: 9780849396243
Condition: New. pp. 224 1st Edition.
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Guidebook for Managing Silicon Chip Reliability
Book 2 of 4: Electronic PackagingLanguage: English
Published by Taylor & Francis Group, 1998
ISBN 10: 0849396247 ISBN 13: 9780849396243
Condition: New. pp. 224.
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Condition: Good. 1st Edition. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Condition: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Plasticâ"Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications
US$ 23.43
US$ 18.07 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. Ex library copy with usual stamps & stickers.
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Hardcover. Condition: Good. The book is in good condition with a clean interior; the cover contain minor bumps and scratches along the spine and edges. Book.
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Prognostics and Health Management of Electronics
Language: English
Published by Wiley & Sons, Incorporated, John, 2008
ISBN 10: 0470278021 ISBN 13: 9780470278024
Condition: Very Good. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Electronics Industry in Taiwan
Book 2 of 3: The Electronics Industry Research SeriesLanguage: English
Published by Taylor & Francis Group, 1997
ISBN 10: 0849331706 ISBN 13: 9780849331701
Condition: New. pp. 176 1st Edition.
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Electronics Industry in Taiwan
Book 2 of 3: The Electronics Industry Research SeriesLanguage: English
Published by Taylor & Francis Group, 1997
ISBN 10: 0849331706 ISBN 13: 9780849331701
Condition: New. pp. 176.
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Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach (Electronic Packaging Series)
Book 4 of 4: Electronic PackagingLanguage: English
Published by CRC Press, Boca Raton, FL, 1997
ISBN 10: 0849394503 ISBN 13: 9780849394508
Seller: Dorley House Books, Inc., Hagerstown, MD, U.S.A.
Seller rating 4 out of 5 stars
First Edition
Hardcover. Condition: Near Fine. B/W Photos; Diagrams, Etc (illustrator). 1st. 1st printing; glossy pictorial c; 307 clean, unmarked pages.
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Hardcover. Condition: Acceptable. Connecting readers with great books since 1972. Used textbooks may not include companion materials such as access codes, etc. May have condition issues including wear and notes/highlighting. We ship orders daily and Customer Service is our top priority!
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Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
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Lead-free Electronics.
Language: English
Published by New York, NY : Wiley, J, 2006
Seller: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Germany
Association Member: GIAQ
Seller rating 5 out of 5 stars
Hardcover. Condition: Sehr gut. 766 p. Very good. Shrink wrapped. Sehr guter Zustand. In Folie verschweißt. Sprache: Englisch Gewicht in Gramm: 1300.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Placement and Routing of Electronic Modules
Book 46 of 55: Electrical and Computer EngineeringLanguage: English
Published by Taylor & Francis Group, 1993
ISBN 10: 0824789164 ISBN 13: 9780824789169
Condition: New. pp. 352.
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Condition: As New. Unread book in perfect condition.
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Condition: As New. Unread book in perfect condition.
