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Synopsis
Based on presentations at the Electronics Packaging Symposium, held at the State University of New York, Binghamton in May 1991, this practical volume provides a multidisciplinary treatment of the field of electronic packaging and multichip modules. Among the topics covered: building long-term reliability by increasing polyimide stability; recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical processes; how to use the finite-difference time-domain approach in electromagnetic modeling; and the development of dedicated test chips for package evaluation in varied field conditions. Annotation copyright Book News, Inc. Portland, Or.
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Electronics Packaging Forum: Multichip Module Technology Issues
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IEEE Press, New York, NY, 1994
ISBN 10: 078030439X
ISBN 13: 9780780304390
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Electronics Packaging Forum
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Electronics Packaging Forum
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Electronics Packaging Forum
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Electronics Packaging Forum: Multichip Module Technology Issues
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Electronics Packaging Forum - Multichip Module Technology Issues
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Electronics Packaging Forum - Multichip Module Technology Issues
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Electronics Packaging Forum - Multichip Module Technology Issues
Published by
IEEE Press, Piscataway, NJ, 1993
ISBN 10: 078030439X
ISBN 13: 9780780304390
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Electronics Packaging Forum: Multichip Module Technology Issues
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ELECTRONICS PACKAGING FORUM MULTICHIP MODULE TECHNOLOGY ISSUES (HB 1994)
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