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Electronics Packaging Forum Multichip (6 results)
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Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
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Electronics Packaging Forum: Multichip Module Technology Issues
Language: English
Published by IEEE Press, New York, NY, 1994
ISBN 10: 078030439X ISBN 13: 9780780304390
Seller: Book Bear, West Brookfield, MA, U.S.A.
Association Member: SNEAB
Seller rating 5 out of 5 stars
Hardcover. Condition: Very Good. 392 pp. Tightly bound. Corners not bumped. Text is free of markings. No ownership markings. Published without dust jacket. Printed boards.
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Hardcover. Condition: New. US SELLER SHIPS FAST FROM USA.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Electronics Packaging Forum - Multichip Module Technology Issues
Language: English
Published by IEEE Press, Piscataway, NJ, 1993
ISBN 10: 078030439X ISBN 13: 9780780304390
Seller: A & I PEDERSEN, Macclesfield, CHS, United Kingdom
Seller rating 5 out of 5 stars
First Edition
US$ 38.69
US$ 57.02 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketHard Cover. First Edition. Hard pictorial covers, an as new copy, pp vii,392. Text figures and tables throughout. Size: 16x24cm.
