HyperTransport 3.1 Interconnect Technology - Softcover

Brian Holden; Don Anderson; Jay Trodden

Softcover

ISBN 10: 0977087824 ISBN 13: 9780977087822

Publisher: MindShare Press, 2008

Synopsis

HyperTransportTM technology has revolutionized microprocessor core interconnect. It serves as the central interconnect technology for nearly all of AMD s microprocessors as well as for a rich ecosystem of other microprocessors, system controllers, graphics processors, network processors, and communications semiconductors. It is a high-speed, low latency, point-to-point, packetized link. The latest version, HyperTransport 3.1, enables data transfer at rates of up to 51.2 GigaBytes per second. It is scalable,...

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About this title

About the Author

Brian Holden has been the Technical Chair of the HyperTransport Consortium since 2002, serves as its V.P. and Acting President, and was made a Fellow in 2006. He was a co-founder of StrataCom, has served in CEO, CTO & Director roles in the communications semiconductor and microprocessor industries, and holds 17 U.S. patents.

Review

Product designers will find this book a uniquely valuable tutorial and reference on HyperTransport link and HTX slot connector technologies including the HyperTransport 3.1 and HTX3 specification revisions. With extensive new content authored by Brian Holden, the long-time technical chair of the HyperTransport Consortium, the book is a personal trainer that effortlessly walks the reader through HyperTransport s strong set of features and rich potential. This book is a...

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Edition details

• Publisher: MindShare Press
• Publication date: 2008
• ISBN 10: 0977087824
• ISBN 13: 9780977087822
• Binding: Perfect Paperback
• Language: English
• Edition number: 1
• Number of pages: 691
• Editor: Don Anderson, Jay Trodden, Maryanne Daves