Items related to Thermal and Structural Electronic Packaging Analysis...
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems) - Softcover
- PublisherCRC Press
- Publication date2024
- ISBN 10 1032160853
- ISBN 13 9781032160856
- BindingPaperback
- LanguageEnglish
- Edition number1
- Number of pages290
Search results for Thermal and Structural Electronic Packaging Analysis...
Stock Image
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Paperback)
Published by
Taylor & Francis Ltd, London, 2024
ISBN 10: 1032160853
ISBN 13: 9781032160856
New
Paperback
Seller: Grand Eagle Retail, Fairfield, OH, U.S.A.
Seller rating 5 out of 5 stars
Paperback. Condition: new. Paperback. Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASAs Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus.Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space. This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Seller Inventory # 9781032160856
Quantity: 1 available
Stock Image
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Seller rating 4 out of 5 stars
Condition: New. Seller Inventory # 47920167-n
Quantity: Over 20 available
Stock Image
Thermal and structural electronic packaging analysis for space and extreme environments
Seller: Books Puddle, New York, NY, U.S.A.
Seller rating 4 out of 5 stars
Condition: New. pages cm First edition Includes bibliographical references and index. Seller Inventory # 26397683624
Quantity: 4 available
Stock Image
Thermal and structural electronic packaging analysis for space and extreme environments
Seller: Majestic Books, Hounslow, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. pages cm. Seller Inventory # 398693495
Quantity: 3 available
Stock Image
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Published by
Taylor & Francis Ltd, 2024
ISBN 10: 1032160853
ISBN 13: 9781032160856
New
Paperback / softback
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days. 460. Seller Inventory # B9781032160856
Quantity: 1 available
Stock Image
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Print on DemandSeller: PBShop.store US, Wood Dale, IL, U.S.A.
Seller rating 5 out of 5 stars
PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000. Seller Inventory # L0-9781032160856
Quantity: Over 20 available
Stock Image
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Seller rating 4 out of 5 stars
Condition: As New. Unread book in perfect condition. Seller Inventory # 47920167
Quantity: Over 20 available
Stock Image
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Print on DemandSeller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 5 out of 5 stars
PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000. Seller Inventory # L0-9781032160856
Quantity: Over 20 available
Stock Image
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Seller: Revaluation Books, Exeter, United Kingdom
Seller rating 5 out of 5 stars
Paperback. Condition: Brand New. 304 pages. 9.18x6.12x0.64 inches. In Stock. Seller Inventory # __1032160853
Quantity: 1 available
Stock Image
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In. Seller Inventory # ria9781032160856_new
Quantity: Over 20 available