Items related to Advanced Wirebond Interconnection Technology

Advanced Wirebond Interconnection Technology - Hardcover

 
9781402077623: Advanced Wirebond Interconnection Technology

Synopsis

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.

"synopsis" may belong to another edition of this title.

Review

From the reviews:

"....intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers.... This book has excellent overall tutorial and enough description of wire and bonding equipment.... If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." (IEEE CPMT, Newsletter)

"This book is intended for an assembly ... . is very good with ‘visual’ explanations for quick grasping of the issues. ... The book has a clear prose style and a very readable font and page layout. ... has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. ... A short but good reference section is at the end." (David W. Palmer, IEEE / CPUT Newsletter, Vol. 28 (2), 2005)

 

"About this title" may belong to another edition of this title.

  • PublisherSpringer
  • Publication date2004
  • ISBN 10 1402077629
  • ISBN 13 9781402077623
  • BindingHardcover
  • LanguageEnglish
  • Number of pages698

Buy Used

Condition: As New
Unread book in perfect condition...
View this item

US$ 20.33 shipping from United Kingdom to U.S.A.

Destination, rates & speeds

Search results for Advanced Wirebond Interconnection Technology

Seller Image

Prasad, Shankara K.
Published by Springer, 2004
ISBN 10: 1402077629 ISBN 13: 9781402077623
New Hardcover

Seller: GreatBookPrices, Columbia, MD, U.S.A.

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Condition: New. Seller Inventory # 2409167-n

Contact seller

Buy New

US$ 381.52
Convert currency
Shipping: US$ 2.64
Within U.S.A.
Destination, rates & speeds

Quantity: Over 20 available

Add to basket

Stock Image

Prasad, Shankara K.
Published by Springer, 2004
ISBN 10: 1402077629 ISBN 13: 9781402077623
New Hardcover

Seller: Ria Christie Collections, Uxbridge, United Kingdom

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Condition: New. In. Seller Inventory # ria9781402077623_new

Contact seller

Buy New

US$ 368.51
Convert currency
Shipping: US$ 16.23
From United Kingdom to U.S.A.
Destination, rates & speeds

Quantity: Over 20 available

Add to basket

Seller Image

Prasad, Shankara K.
Published by Springer, 2004
ISBN 10: 1402077629 ISBN 13: 9781402077623
New Hardcover

Seller: GreatBookPricesUK, Woodford Green, United Kingdom

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Condition: New. Seller Inventory # 2409167-n

Contact seller

Buy New

US$ 368.50
Convert currency
Shipping: US$ 20.33
From United Kingdom to U.S.A.
Destination, rates & speeds

Quantity: Over 20 available

Add to basket

Seller Image

Shankara K. Prasad
Published by Springer US, 2004
ISBN 10: 1402077629 ISBN 13: 9781402077623
New Hardcover

Seller: moluna, Greven, Germany

Seller rating 4 out of 5 stars 4-star rating, Learn more about seller ratings

Condition: New. From the reviews: This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and autom. Seller Inventory # 4095296

Contact seller

Buy New

US$ 396.24
Convert currency
Shipping: US$ 55.96
From Germany to U.S.A.
Destination, rates & speeds

Quantity: Over 20 available

Add to basket

Seller Image

Prasad, Shankara K.
Published by Springer, 2004
ISBN 10: 1402077629 ISBN 13: 9781402077623
Used Hardcover

Seller: GreatBookPricesUK, Woodford Green, United Kingdom

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Condition: As New. Unread book in perfect condition. Seller Inventory # 2409167

Contact seller

Buy Used

US$ 461.99
Convert currency
Shipping: US$ 20.33
From United Kingdom to U.S.A.
Destination, rates & speeds

Quantity: Over 20 available

Add to basket

Seller Image

Prasad, Shankara K.
Published by Springer, 2004
ISBN 10: 1402077629 ISBN 13: 9781402077623
Used Hardcover

Seller: GreatBookPrices, Columbia, MD, U.S.A.

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Condition: As New. Unread book in perfect condition. Seller Inventory # 2409167

Contact seller

Buy Used

US$ 481.34
Convert currency
Shipping: US$ 2.64
Within U.S.A.
Destination, rates & speeds

Quantity: Over 20 available

Add to basket

Stock Image

Prasad, Shankara K.
Published by Springer, 2004
ISBN 10: 1402077629 ISBN 13: 9781402077623
Used Hardcover

Seller: Mispah books, Redhill, SURRE, United Kingdom

Seller rating 4 out of 5 stars 4-star rating, Learn more about seller ratings

Hardcover. Condition: Like New. Like New. book. Seller Inventory # ERICA77314020776296

Contact seller

Buy Used

US$ 450.84
Convert currency
Shipping: US$ 33.88
From United Kingdom to U.S.A.
Destination, rates & speeds

Quantity: 1 available

Add to basket

Seller Image

Shankara K Prasad
Published by Springer Us Apr 2004, 2004
ISBN 10: 1402077629 ISBN 13: 9781402077623
New Taschenbuch

Seller: AHA-BUCH GmbH, Einbeck, Germany

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Taschenbuch. Condition: Neu. Neuware - Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way. Seller Inventory # 9781402077623

Contact seller

Buy New

US$ 558.37
Convert currency
Shipping: US$ 38.78
From Germany to U.S.A.
Destination, rates & speeds

Quantity: 2 available

Add to basket