Solder Joint Reliability Prediction for Multiple Environments

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9781441946348: Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

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Andrew Eugene Perkins, Suresh K. Sitaraman
Published by Springer-Verlag New York Inc., United States (2010)
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Book Description Springer-Verlag New York Inc., United States, 2010. Paperback. Book Condition: New. Language: English . Brand New Book ***** Print on Demand *****.Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries. Softcover reprint of hardcover 1st ed. 2009. Bookseller Inventory # AAV9781441946348

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Andrew Eugene Perkins, Suresh K. Sitaraman
Published by Springer-Verlag New York Inc., United States (2010)
ISBN 10: 1441946349 ISBN 13: 9781441946348
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Book Description Springer-Verlag New York Inc., United States, 2010. Paperback. Book Condition: New. Language: English . This book usually ship within 10-15 business days and we will endeavor to dispatch orders quicker than this where possible. Brand New Book. Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries. Softcover reprint of hardcover 1st ed. 2009. Bookseller Inventory # LIE9781441946348

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Andrew Eugene Perkins, Suresh K. Sitaraman
Published by Springer-Verlag New York Inc., United States (2010)
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Book Description Springer-Verlag New York Inc., United States, 2010. Paperback. Book Condition: New. Language: English . Brand New Book ***** Print on Demand *****. Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries. Softcover reprint of hardcover 1st ed. 2009. Bookseller Inventory # AAV9781441946348

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Perkins, Andrew E.; Sitaraman, Suresh K.
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Book Description Springer, 2016. Paperback. Book Condition: New. PRINT ON DEMAND Book; New; Publication Year 2016; Not Signed; Fast Shipping from the UK. No. book. Bookseller Inventory # ria9781441946348_lsuk

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Book Description Springer, 2010. Paperback. Book Condition: NEW. 9781441946348 This listing is a new book, a title currently in-print which we order directly and immediately from the publisher. Bookseller Inventory # HTANDREE0297119

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Book Description Springer-Verlag New York Inc., 2010. PAP. Book Condition: New. New Book. Delivered from our UK warehouse in 3 to 5 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000. Bookseller Inventory # LQ-9781441946348

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