Items related to Failure Modes and Mechanisms in Electronic Packages
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
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- PublisherSpringer
- Publication date2012
- ISBN 10 1461377633
- ISBN 13 9781461377634
- BindingPaperback
- Number of pages391
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Failure Modes and Mechanisms in Electronic Packages by Singh, P. [Paperback ]
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Failure Modes and Mechanisms in Electronic Packages
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Failure Modes and Mechanisms in Electronic Packages
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Book Description Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Those of us who grew up in the 'through-hole' age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems almost to take for granted the innovations that leave me somewhat awestruck at times. Electronic circuit designers delight in packing more punch into less volume, while reminding us that their job has become increasingly challenging. The lay person also has learned from the media that the industry has been working wonders in shrinking the transistor and expanding the power of 'the chip. ' Much attention is focussed on the silicon and on the marvelous production and entertainment tools we now see in our offices and homes. Between the silicon and the end product lies the less publicized world of circuit-level packaging. We leave it to a cadre of technologists to take the schematics and parts lists and to develop the processes that tum the designers' concepts into physical reality. And while the silicon transistor is shrinking, the engineering challenges of packaging multiple chips and associated components into increasingly dense subsystems are growing. Further, the transistor may have to function without failure through severe industrial or military environments over the lifetime of the product. 396 pp. Englisch. Seller Inventory # 9781461377634
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Failure Modes and Mechanisms in Electronic Packages
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ISBN 10: 1461377633
ISBN 13: 9781461377634
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Book Description Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Those of us who grew up in the 'through-hole' age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems almost to take for granted the innovations that leave me somewhat awestruck at times. Electronic circuit designers delight in packing more punch into less volume, while reminding us that their job has become increasingly challenging. The lay person also has learned from the media that the industry has been working wonders in shrinking the transistor and expanding the power of 'the chip. ' Much attention is focussed on the silicon and on the marvelous production and entertainment tools we now see in our offices and homes. Between the silicon and the end product lies the less publicized world of circuit-level packaging. We leave it to a cadre of technologists to take the schematics and parts lists and to develop the processes that tum the designers' concepts into physical reality. And while the silicon transistor is shrinking, the engineering challenges of packaging multiple chips and associated components into increasingly dense subsystems are growing. Further, the transistor may have to function without failure through severe industrial or military environments over the lifetime of the product. Seller Inventory # 9781461377634
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Failure Modes and Mechanisms in Electronic Packages
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(2012)
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ISBN 13: 9781461377634
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