Items related to The Simulation of Thermomechanically Induced Stress...
Synopsis
List of Figures. List of Tables. Preface. Acknowledgments. 1. An Introduction to Plastic Packaging. 2. A Review of Package Stress Modelling. 3. Thermomechanical Stress in a PQFP. 4. The Correlation of Modelling with Measurements and Failure Modes. 5. Accurate Prediction of PQFP Warpage. 6. Microsystem Packaging in Plastic and in 3D. 7. Concluding Remarks. References. Appendices: A. Analytical Model of Encapsulation Stress. B. Fundamentals of Stress and Strain. C. Axial Stress and Bending Stress. Index.
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