Impact of TSV and Device Scaling on the Quality of 3D Ics.- 3D Integration Technology.- Design and Optimization of Spin-Transfer Torque MRAMs.- Embedded STT-MRAM: Device and Design.- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis.- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors.- Design Automation for On-chip Nanophotonic Integration.
"synopsis" may belong to another edition of this title.
Rasit O. Topaloglu is an Advisory R&D Engineer at IBM.
"About this title" may belong to another edition of this title.
(No Available Copies)
Search Books: Create a WantCan't find the book you're looking for? We'll keep searching for you. If one of our booksellers adds it to AbeBooks, we'll let you know!
Create a Want