Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics)

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9781598292442: Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics)
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This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

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Book Description Morgan & Claypool Publishers, United States, 2007. Paperback. Condition: New. Language: English. Brand new Book. This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Seller Inventory # AAN9781598292442

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Book Description Morgan Claypool Publishers, United States, 2007. Paperback. Condition: New. Language: English . Brand New Book. This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Seller Inventory # AAN9781598292442

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Book Description Morgan & Claypool Publishers, United States, 2007. Paperback. Condition: New. Language: English. Brand new Book. This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Seller Inventory # LIE9781598292442

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Book Description Morgan & Claypool. Paperback. Condition: New. 108 pages. Dimensions: 9.1in. x 7.4in. x 0.5in.This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends. Various examples of fully-integrated passive building blocks (cavitymicrostip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RFWireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. This item ships from multiple locations. Your book may arrive from Roseburg,OR, La Vergne,TN. Paperback. Seller Inventory # 9781598292442

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