Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ― 2009: Volume 1156 (MRS Proceedings) - Hardcover

 
9781605111292: Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ― 2009: Volume 1156 (MRS Proceedings)
Hardcover
ISBN 10: 1605111295 ISBN 13: 9781605111292
Publisher: Cambridge University Press, 2009

Synopsis

Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.

"synopsis" may belong to another edition of this title.

Book Description

This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.

"About this title" may belong to another edition of this title.

Publisher
Cambridge University Press
Publication date
2009
Language
English
ISBN 10 
1605111295
ISBN 13 
9781605111292
Binding
Hardcover
Edition number
1
Number of pages
189
Editor
Gall Martin, Grill Alfred, Lacopi Francesca, Koike Junichi, Usui Takamasa

Other Popular Editions of the Same Title

9781107408319: Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ― 2009: Volume 1156 (MRS Proceedings)

Featured Edition

ISBN 10:  1107408318 ISBN 13:  9781107408319
Publisher: Cambridge University Press, 2014
Softcover