Koike Junichi (37 results)
- Softcover
Seller: California Books, Miami, U.S.A.California Books
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- Softcover
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- Softcover
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- Softcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, IrelandKennys Bookshop and Art Galleries Ltd.
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- Softcover
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US$ 61.39
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Condition: New. pp. 204.
- Softcover
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- Hardcover
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-…values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, U.S.A.GreatBookPrices
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- Hardcover
Seller: California Books, Miami, U.S.A.California Books
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- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 144.81
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Published by Chuokoronsha 1978
- Softcover
Seller: Sunny Day Bookstore, SINGAPORE, SingaporeSunny Day Bookstore
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Bijutsu Techo March 1986 Special feature on Schiele and Vienna
Authors: Yoshikuni Iida Kazuko Koike Makoto Takimoto Junichi Shimomura Nobuyuki Chisoku and others.
Published by Bijutsu Shuppan-Sha Co. Ltd. 1986
- Softcover
Seller: Sunny Day Bookstore, SINGAPORE, SingaporeSunny Day Bookstore
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Published by Chuokoronsha 1978
- Softcover
Seller: Sunny Day Bookstore, SINGAPORE, SingaporeSunny Day Bookstore
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Published by Shogakukan Inc. 1941
- Softcover
Seller: Sunny Day Bookstore, SINGAPORE, SingaporeSunny Day Bookstore
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Add to basketCondition: Fine. Size: B5.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Edited by Martin Gall , Alfred Grill , Francesca Lacopi , Junichi Koike , Takamasa Usui
- Hardcover
- First Edition
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, IrelandKennys Bookshop and Art Galleries Ltd.
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US$ 168.94
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Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U)… Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . .
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 174.95
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Mispah books, Redhill, United KingdomMispah books
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, U.S.A.GreatBookPrices
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Books Puddle, New York, U.S.A.Books Puddle
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US$ 193.43
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Condition: New. pp. viii + 189.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009: Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, M. (Editor)/ Grill, A. (Editor)/ Lacopi, F. (Editor)/ Koike, J. (Editor)/ Usui, T. (Editor)
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 189 pages. 9.00x6.25x0.75 inches. In Stock.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Edited by Martin Gall , Alfred Grill , Francesca Lacopi , Junichi Koike , Takamasa Usui
- Hardcover
Seller: Kennys Bookstore, Olney, U.S.A.Kennys Bookstore
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US$ 198.87
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Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U)… Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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US$ 181.61
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values…and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
- Softcover
- Print on Demand
Seller: Grand Eagle Retail, Bensenville, U.S.A.Grand Eagle Retail
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US$ 46.99
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Paperback. Condition: new. Paperback. Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties…, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics â" 2009: Volume 1156
Edited by Martin Gall , Alfred Grill , Francesca Lacopi , Junichi Koike , Takamasa Usui
- Softcover
- Print on Demand
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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US$ 41.21
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Paperback. Condition: Brand New. 1st edition. 204 pages. 9.02x5.98x0.43 inches. In Stock. This item is printed on demand.
- Softcover
- Print on Demand
Seller: THE SAINT BOOKSTORE, Southport, United KingdomTHE SAINT BOOKSTORE
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US$ 47.95
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Paperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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US$ 58.37
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Condition: New. Print on Demand pp. 204.
Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Gall Martin Usui Takamasa Koike Junichi Lacopi Francesca Grill Alfred
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, GermanyBiblios
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US$ 63.21
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Condition: New. PRINT ON DEMAND pp. 204.
- Softcover
- Print on Demand
Seller: CitiRetail, Stevenage, United KingdomCitiRetail
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Paperback. Condition: new. Paperback. Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties…, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
