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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan - Hardcover
Synopsis
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
"synopsis" may belong to another edition of this title.
Language Notes
Text: English (translation)
Original Language: Japanese
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Multilayer Ceramic Substrate-Technology for Vlsi Package/Multichip Module Otsuka, K.
Seller: Librairie Parrêsia, Figeac, France
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Hardcover Apr 30, 1993. Condition: Used: Good. Multilayer Ceramic Substrate-Technology for Vlsi Package/Multichip Module | Otsuka | Elsevier, 1991. In-8° cartonné, 242 pages. Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage. Très bon état général pour cet ouvrage. [NM37]. Seller Inventory # 1219S0T2YA5
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
Print on DemandSeller: moluna, Greven, Germany
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Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent J. Seller Inventory # 4289215
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Condition: New. In English. Seller Inventory # ria9781851665792_new
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module | Ceramic research and development in Japan
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Buch. Condition: Neu. Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module | Ceramic research and development in Japan | K. Otsuka | Buch | xiv | Englisch | 1993 | Springer Netherland | EAN 9781851665792 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. Seller Inventory # 101952496
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
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Springer Netherlands, Springer Netherlands Apr 1993, 1993
ISBN 10: 185166579X
ISBN 13: 9781851665792
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Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 260 pp. Englisch. Seller Inventory # 9781851665792
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Multilayer Ceramic Substrate - Technology for VLSI Package
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Kluwer Academic Publishers Group, 1993
ISBN 10: 185166579X
ISBN 13: 9781851665792
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Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
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Condition: New. Presents a translation of an important Japanese work on electronic ceramics and includes much experimental data. This title is of interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of Japanese research in this field. Num Pages: 242 pages, biography. BIC Classification: TDCQ; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 254 x 178 x 16. Weight in Grams: 1200. . 1993. Hardback. . . . . Seller Inventory # V9781851665792
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
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Springer Netherlands Apr 1993, 1993
ISBN 10: 185166579X
ISBN 13: 9781851665792
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field. 260 pp. Englisch. Seller Inventory # 9781851665792
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Multilayer Ceramic Substrate - Technology for VLSI Package
Published by
Kluwer Academic Publishers Group, 1993
ISBN 10: 185166579X
ISBN 13: 9781851665792
New
Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.
Seller rating 5 out of 5 stars
Condition: New. Presents a translation of an important Japanese work on electronic ceramics and includes much experimental data. This title is of interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of Japanese research in this field. Num Pages: 242 pages, biography. BIC Classification: TDCQ; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 254 x 178 x 16. Weight in Grams: 1200. . 1993. Hardback. . . . . Books ship from the US and Ireland. Seller Inventory # V9781851665792
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module : Ceramic research and development in Japan
Seller: AHA-BUCH GmbH, Einbeck, Germany
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field. Seller Inventory # 9781851665792
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