Testing of Interposer-Based 2.5D Integrated Circuits - Softcover

Wang, Ran; Chakrabarty, Krishnendu

 
9783319547152: Testing of Interposer-Based 2.5D Integrated Circuits
Softcover
ISBN 10: 3319547151 ISBN 13: 9783319547152
Publisher: Springer, 2017

This specific ISBN edition is currently not available.

Synopsis

Introduction.- Pre-Bond Testing of the Silicon Interposer.- Post-Bond Scan-based Testing of Interposer Interconnects.- Test Architecture and Test-Path Scheduling.- Built-In Self-Test.- ExTest Scheduling and Optimization.- A Programmable Method for Low-Power Scan Shift in SoC Dies.- Conclusions.-

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Publisher
Springer
Publication date
2017
Language
English
ISBN 10 
3319547151
ISBN 13 
9783319547152
Binding
Paperback
Number of pages
198

Other Popular Editions of the Same Title

9783319547138: Testing of Interposer-Based 2.5D Integrated Circuits

Featured Edition

ISBN 10:  3319547135 ISBN 13:  9783319547138
Publisher: Springer, 2017
Hardcover