Items related to Testing of Interposer-Based 2.5D Integrated Circuits
Synopsis
Introduction.- Pre-Bond Testing of the Silicon Interposer.- Post-Bond Scan-based Testing of Interposer Interconnects.- Test Architecture and Test-Path Scheduling.- Built-In Self-Test.- ExTest Scheduling and Optimization.- A Programmable Method for Low-Power Scan Shift in SoC Dies.- Conclusions.-
"synopsis" may belong to another edition of this title.
- PublisherSpringer
- Publication date2017
- ISBN 10 3319547151
- ISBN 13 9783319547152
- BindingPaperback
- LanguageEnglish
- Number of pages198
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