Design for testability and test optimization technology for 3D stacked integrated circuits based on TSV(Chinese Edition) - Softcover
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Language:Chinese.paperback.Pub Date:2024-06.publisher:Mechanical Industry Press.description:Paperback. Pub Date: 2024-06 Publisher: China Machine Press Testing is a method used to ensure the stability and effectiveness of integrated circuits. and is an indispensable and important means throughout all aspects of integrated circuit manufactur
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Design for testability and test optimization technology for 3D stacked integrated circuits based on TSV(Chinese Edition)
Published by
Mechanical Industry Press, 2024
ISBN 10: 711175364X
ISBN 13: 9787111753643
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Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2024-06 Publisher: China Machine Press Testing is a method used to ensure the stability and effectiveness of integrated circuits. and is an indispensable and important means throughout all aspects of integrated circuit manufacturing. The particularity of the TSV-based 3D stacked integrated circuit structure and the variability of the design process bring new problems and challenges to the testing process. This book first discusses the basic concepts. basi. Seller Inventory # DR007345
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