9787515921648 (1 results)
3D Integration Handbook Volume 3 Three-Dimensional Process Technology(Chinese Edition)
[ MEI ] FEI LI PU· JIA LUO ( Philip Garrou ) . [ RI ] XIAO LIU GUANG ZHENG ( Mitsumasa Koyanagi ) . [ DE ] BI DE· LA MU ( Peter Ramm ) . WU DAO WEI . WANG WEI . LIU JIAN JUN . YU HUAN DENG YI
Language: English
- Hardcover
Seller: liu xing, Nanjing, Chinaliu xing
Contact seller5-star sellerCondition: New
US$ 159.33
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Hardcover. Condition: New. HardCover.Pub Date:2022-10 Pages:369 Language:ChinesePublisher:China Aerospace PressSelf-operated3D Integration Handbook Volume 3 Three-Dimensional Process Technologyis divided into 22 chapters. namely: 3D IC integration since 2008. main applications and market trends of 3D integration and interposer t…echnology. economic drivers and barriers to 2.5D/3D integration. interposer technology. TSV manufacturing overview. TSV unit process and integration. TSV preparation of ASET. laser-assisted wafe.
