Items related to Electronics Packaging Forum: Volume One
This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant visibility in recent years as it has become obvious that the near-future limitations to the continued development of high performance electronic chips will arise from technological problems in their packaging. The two most obvious of these are the escalating difficulties of removing Joule heat from circuits packed ever more closely together, and the problem of providing more and more electrical contacts to smaller and smaller packages. As recognition of these problems has developed, organizations such as NSF, SRC and MCC have joined with industry in calling for increased research effort in the area. The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly. The field is inherently multi-disciplinary, incorporating several of the traditional sub-areas of Mechanical and Electrical Engineering, Physics and Chemistry.
"synopsis" may belong to another edition of this title.
- PublisherSpringer
- Publication date2012
- ISBN 10 9401092885
- ISBN 13 9789401092883
- BindingPaperback
- Number of pages357
Buy New
Learn more about this copy
US$ 55.80
Shipping:
FREE
Within U.S.A.
Top Search Results from the AbeBooks Marketplace
Seller Image
Electronics Packaging Forum: Volume One by Morris, James E. [Paperback ]
Seller:
Rating
Book Description Soft Cover. Condition: new. Seller Inventory # 9789401092883
Buy New
US$ 55.80
Convert currency
Seller Image
Electronics Packaging Forum
Seller:
Rating
Book Description Condition: New. Seller Inventory # 21297025-n
Buy New
US$ 60.63
Convert currency
Stock Image
Electronics Packaging Forum: Volume One
Seller:
Rating
Book Description Condition: New. Seller Inventory # ABLIING23Apr0412070058451
Buy New
US$ 59.29
Convert currency
Stock Image
Electronics Packaging Forum: Volume One
Published by
Springer
(2012)
ISBN 10: 9401092885
ISBN 13: 9789401092883
New
Softcover
Quantity: > 20
Seller:
Rating
Book Description Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book. Seller Inventory # ria9789401092883_lsuk
Buy New
US$ 64.51
Convert currency
Seller Image
Electronics Packaging Forum
Seller:
Rating
Book Description Condition: New. Seller Inventory # 21297025-n
Buy New
US$ 64.50
Convert currency
Seller Image
Electronics Packaging Forum
Published by
Springer Netherlands Mai 2012
(2012)
ISBN 10: 9401092885
ISBN 13: 9789401092883
New
Taschenbuch
Quantity: 2
Seller:
Rating
Book Description Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant visibility in recent years as it has become obvious that the near-future limitations to the continued development of high performance electronic chips will arise from technological problems in their packaging. The two most obvious of these are the escalating difficulties of removing Joule heat from circuits packed ever more closely together, and the problem of providing more and more electrical contacts to smaller and smaller packages. As recognition of these problems has developed, organizations such as NSF, SRC and MCC have joined with industry in calling for increased research effort in the area. The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly. The field is inherently multi-disciplinary, incorporating several of the traditional sub-areas of Mechanical and Electrical Engineering, Physics and Chemistry. 360 pp. Englisch. Seller Inventory # 9789401092883
Buy New
US$ 60.00
Convert currency
Stock Image
Electronics Packaging Forum: Vol 1
Published by
Springer Verlag
(2012)
ISBN 10: 9401092885
ISBN 13: 9789401092883
New
Paperback
Quantity: 2
Seller:
Rating
Book Description Paperback. Condition: Brand New. reprint edition. 360 pages. 9.02x5.98x0.55 inches. In Stock. Seller Inventory # x-9401092885
Buy New
US$ 76.65
Convert currency
Stock Image
Electronics Packaging Forum
Seller:
Rating
Book Description Condition: New. Num Pages: 357 pages, 54 black & white illustrations, biography. BIC Classification: TDP; TJF. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 19. Weight in Grams: 527. . 2012. Softcover reprint of the original 1st ed. 1990. paperback. . . . . Seller Inventory # V9789401092883
Buy New
US$ 82.91
Convert currency
Seller Image
Electronics Packaging Forum : Volume One
Published by
Springer Netherlands
(2012)
ISBN 10: 9401092885
ISBN 13: 9789401092883
New
Taschenbuch
Quantity: 1
Seller:
Rating
Book Description Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant visibility in recent years as it has become obvious that the near-future limitations to the continued development of high performance electronic chips will arise from technological problems in their packaging. The two most obvious of these are the escalating difficulties of removing Joule heat from circuits packed ever more closely together, and the problem of providing more and more electrical contacts to smaller and smaller packages. As recognition of these problems has developed, organizations such as NSF, SRC and MCC have joined with industry in calling for increased research effort in the area. The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly. The field is inherently multi-disciplinary, incorporating several of the traditional sub-areas of Mechanical and Electrical Engineering, Physics and Chemistry. Seller Inventory # 9789401092883
Buy New
US$ 65.18
Convert currency
Stock Image
Electronics Packaging Forum
Seller:
Rating
Book Description Condition: New. Num Pages: 357 pages, 54 black & white illustrations, biography. BIC Classification: TDP; TJF. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 19. Weight in Grams: 527. . 2012. Softcover reprint of the original 1st ed. 1990. paperback. . . . . Books ship from the US and Ireland. Seller Inventory # V9789401092883
Buy New
US$ 96.36
Convert currency