Synopsis
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
"synopsis" may belong to another edition of this title.
About the Author
For Internal Use Only:
John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow
Unimicron Technology Corporation, John_Lau@unimicron.com
SPECIALIZED PROFESSIONAL COMPETENCIES
[1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability.
[2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging.
[3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers.
Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.
From the Back Cover
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
"About this title" may belong to another edition of this title.
Other Popular Editions of the Same Title
Search results for Chiplet Design and Heterogeneous Integration Packaging
Stock Image
Chiplet Design and Heterogeneous Integration Packaging (Hardcover)
Published by
Springer Verlag, Singapore, Singapore, 2023
ISBN 10: 9811999163
ISBN 13: 9789811999161
New
Hardcover
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: new. Hardcover. The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Seller Inventory # 9789811999161
Stock Image
Chiplet Design and Heterogeneous Integration Packaging
Seller: Biblios, Frankfurt am main, HESSE, Germany
Seller rating 4 out of 5 stars
Condition: New. Seller Inventory # 18395483840
Buy New
US$ 228.00
US$ 11.58 shipping
Ships from Germany to U.S.A.
Ships from Germany to U.S.A.
Quantity: 1 available
Stock Image
Chiplet Design and Heterogeneous Integration Packaging
Seller: Revaluation Books, Exeter, United Kingdom
Seller rating 5 out of 5 stars
Hardcover. Condition: Brand New. 547 pages. 9.25x6.10x1.26 inches. In Stock. Seller Inventory # __9811999163
Buy New
US$ 221.80
US$ 20.19 shipping
Ships from United Kingdom to U.S.A.
Ships from United Kingdom to U.S.A.
Quantity: 1 available
Seller Image
Chiplet Design and Heterogeneous Integration Packaging
Published by
Springer, Berlin|Springer Nature Singapore|Springer, 2023
ISBN 10: 9811999163
ISBN 13: 9789811999161
New
Hardcover
Seller: moluna, Greven, Germany
Seller rating 5 out of 5 stars
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is. Seller Inventory # 779407477
Buy New
US$ 189.85
US$ 57.00 shipping
Ships from Germany to U.S.A.
Ships from Germany to U.S.A.
Quantity: Over 20 available
Seller Image
Chiplet Design and Heterogeneous Integration Packaging
Published by
Springer Nature Singapore, Springer Nature Singapore Mär 2023, 2023
ISBN 10: 9811999163
ISBN 13: 9789811999161
New
Hardcover
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. 548 pp. Englisch. Seller Inventory # 9789811999161
Buy New
US$ 230.82
US$ 26.76 shipping
Ships from Germany to U.S.A.
Ships from Germany to U.S.A.
Quantity: 2 available
Seller Image
Chiplet Design and Heterogeneous Integration Packaging
Print on DemandSeller: preigu, Osnabrück, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. Chiplet Design and Heterogeneous Integration Packaging | John H. Lau | Buch | xxii | Englisch | 2023 | Springer | EAN 9789811999161 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. Seller Inventory # 126243632
Buy New
US$ 196.85
US$ 81.45 shipping
Ships from Germany to U.S.A.
Ships from Germany to U.S.A.
Quantity: 5 available
Stock Image
Chiplet Design and Heterogeneous Integration Packaging
Print on DemandSeller: Majestic Books, Hounslow, United Kingdom
Seller rating 4 out of 5 stars
Condition: New. Print on Demand This item is printed on demand. Seller Inventory # 400893205
Buy New
US$ 274.79
US$ 8.75 shipping
Ships from United Kingdom to U.S.A.
Ships from United Kingdom to U.S.A.
Quantity: 4 available
Stock Image
Chiplet Design and Heterogeneous Integration Packaging
Seller: Books Puddle, New York, NY, U.S.A.
Seller rating 4 out of 5 stars
Condition: New. Seller Inventory # 26395483850
Seller Image
Chiplet Design and Heterogeneous Integration Packaging
Published by
Springer, Springer Mär 2023, 2023
ISBN 10: 9811999163
ISBN 13: 9789811999161
New
Hardcover
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 548 pp. Englisch. Seller Inventory # 9789811999161
Buy New
US$ 230.82
US$ 69.81 shipping
Ships from Germany to U.S.A.
Ships from Germany to U.S.A.
Quantity: 1 available
Seller Image
Chiplet Design and Heterogeneous Integration Packaging
Published by
Springer Nature Singapore, Springer Nature Singapore, 2023
ISBN 10: 9811999163
ISBN 13: 9789811999161
New
Hardcover
Seller: AHA-BUCH GmbH, Einbeck, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. Seller Inventory # 9789811999161
Buy New
US$ 237.53
US$ 76.10 shipping
Ships from Germany to U.S.A.
Ships from Germany to U.S.A.
Quantity: 1 available